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Name: 10AX115N4F40I3SGE2
Brand: Intel
SKU: 10AX115N4F40I3SGE2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115N4F40I3SGE2

Part No.:: 10AX115N4F40I3SGE2

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115N4F40I3SGE2.pdf

Description:: IC FPGA 600 I/O 1517FCBGA

In Stock:: 2455

Quantity:: Add To Cart

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10AX115N4F40I3SGE2 Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N4F40I3SGE2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N4F40I3SGE2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N4F40I3SGE2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N4F40I3SGE2 information

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10AX115N4F40I3SGE2 Application Introduction

10AX115N4F40I3SGE2 is a field-programmable gate array (FPGA) known for its high performance and versatility in a wide range of applications, including telecommunications, automotive, and industrial automation.

Application Scenario:

In industrial automation, 10AX115N4F40I3SGE2 can be utilized for tasks such as real-time control of robotic arms or monitoring and controlling manufacturing processes.

Circuit Design:

To effectively incorporate 10AX115N4F40I3SGE2 into your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure stable and reliable operation of 10AX115N4F40I3SGE2 and associated peripherals. Utilize voltage regulators and power sequencing circuits to provide clean power to the FPGA and mitigate power supply noise.

2. Signal Integrity:

Design the PCB layout to minimize signal degradation and electromagnetic interference (EMI). Pay attention to routing high-speed signals and use controlled impedance traces for critical signal paths connected to 10AX115N4F40I3SGE2.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX115N4F40I3SGE2 by incorporating heat sinks, thermal vias, and proper airflow in the system enclosure. Monitor the temperature of the FPGA and implement thermal throttling or cooling mechanisms to prevent overheating.

4. Clock Distribution:

Implement a clean and stable clock distribution network to provide synchronous clock signals to 10AX115N4F40I3SGE2 and synchronize with external devices. Use low-jitter clock sources and carefully route clock traces to minimize clock skew and ensure reliable operation.

5. Configuration Management:

Optimize FPGA configuration and programming strategies to minimize configuration time and ensure quick system boot-up. Utilize configuration compression techniques and selective reconfiguration features to reduce configuration overhead and enhance system flexibility.

Considerations:

When designing with 10AX115N4F40I3SGE2, keep the following considerations in mind:

- Resource Utilization: Optimize FPGA resource usage to maximize performance and minimize resource conflicts. Utilize synthesis and optimization tools to efficiently allocate logic elements, memory blocks, and DSP slices.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met, and critical paths are properly optimized for maximum operating frequency.

- Debugging and Verification: Implement built-in self-test (BIST) features and debug interfaces to facilitate system debugging and verification. Utilize simulation and emulation tools for comprehensive system testing and validation.

- Design Security: Implement security features, such as encryption and authentication, to protect FPGA bitstreams and intellectual property from unauthorized access and tampering.

- Design for Manufacturability: Design the system for ease of manufacturing and assembly, considering factors such as component availability, testability, and reliability.

10AX115N4F40I3SGE2 FAQ

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3. Are the 10AX115N4F40I3SGE2 price and inventory displayed accurate?

The price and inventory of 10AX115N4F40I3SGE2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115N4F40I3SGE2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N4F40I3SGE2 we delivered, we will accept the replacement or return of the 10AX115N4F40I3SGE2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N4F40I3SGE2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations