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Name: 10AX115N4F40I3SG
Brand: Intel
SKU: 10AX115N4F40I3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115N4F40I3SG

Part No.:: 10AX115N4F40I3SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115N4F40I3SG.pdf

Description:: IC FPGA 600 I/O 1517FCBGA

In Stock:: 3701

Quantity:: Add To Cart

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10AX115N4F40I3SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N4F40I3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N4F40I3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N4F40I3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N4F40I3SG information

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10AX115N4F40I3SG Application Introduction

10AX115N4F40I3SG is a versatile FPGA (Field Programmable Gate Array) chip with advanced capabilities, commonly utilized in a wide range of electronic design projects for various applications. It features high-performance logic elements, abundant memory resources, and flexible I/O interfaces.

Application Scenario:

In digital signal processing applications, 10AX115N4F40I3SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX115N4F40I3SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of 10AX115N4F40I3SG and associated components. Utilize voltage regulators and power monitoring circuits to maintain optimal power levels and prevent voltage fluctuations.

2. Signal Integrity:

Pay attention to signal integrity by carefully designing PCB layouts and routing traces to minimize signal degradation and interference. Use proper termination techniques and impedance matching to maintain signal integrity, especially for high-speed interfaces.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable performance of 10AX115N4F40I3SG under various operating conditions. Utilize heat sinks, thermal vias, and airflow optimization techniques to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX115N4F40I3SG and other clock-dependent components. Minimize clock skew and jitter to maintain timing accuracy and reliability.

5. I/O Optimization:

Optimize the utilization of I/O resources by carefully mapping external interfaces and peripherals to 10AX115N4F40I3SG's I/O pins. Consider factors such as signal compatibility, voltage levels, and timing requirements when configuring I/O interfaces.

Considerations:

When designing with 10AX115N4F40I3SG, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize performance and minimize resource constraints.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and to prevent timing violations that could affect system functionality.

- Design Validation: Validate the design through simulation, emulation, and prototype testing to verify functionality, performance, and reliability before final deployment.

- Design Reusability: Design with modularity and scalability in mind to facilitate reusability and adaptation of the design for future projects or iterations.

- Compliance and Standards: Ensure compliance with relevant industry standards and regulations, such as FCC for electromagnetic compatibility (EMC), to avoid potential issues during product certification.

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3. Are the 10AX115N4F40I3SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115N4F40I3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N4F40I3SG we delivered, we will accept the replacement or return of the 10AX115N4F40I3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N4F40I3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations