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Name: 10AX115N3F45I2SGES
Brand: Intel
SKU: 10AX115N3F45I2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 10AX115N3F45I2SGES

Part No.:: 10AX115N3F45I2SGES

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115N3F45I2SGES.pdf

Description:: IC FPGA 768 I/O 1932FBGA

In Stock:: 3574

Quantity:: Add To Cart

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10AX115N3F45I2SGES Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
768
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N3F45I2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N3F45I2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N3F45I2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N3F45I2SGES information

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10AX115N3F45I2SGES Application Introduction

10AX115N3F45I2SGES is a Field Programmable Gate Array (FPGA) chip known for its high performance and versatility, commonly used in various electronic design projects for its flexibility and scalability.

Application Scenario:

In digital signal processing applications, 10AX115N3F45I2SGES can be utilized to implement complex algorithms for tasks such as image processing, audio processing, or communication protocols.

Circuit Design:

To effectively utilize 10AX115N3F45I2SGES in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources on the 10AX115N3F45I2SGES chip. Utilize power gating, dynamic voltage, and frequency scaling (DVFS), and clock gating techniques to minimize power consumption during both active and idle states.

2. Signal Integrity:

Pay close attention to signal integrity to maintain reliable communication and operation within the FPGA design. Properly terminate high-speed signals, manage transmission line effects, and minimize signal reflections to prevent signal degradation and ensure accurate data transmission.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating and ensure the longevity and reliability of the 10AX115N3F45I2SGES chip. Utilize thermal vias, heat sinks, and proper airflow within the system to dissipate heat efficiently and maintain the operating temperature within acceptable limits.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and stable clock signals throughout the FPGA design. Utilize clock buffers, phase-locked loops (PLLs), and clock skew optimization techniques to minimize clock skew and jitter, ensuring synchronous operation of all components within the design.

5. Resource Utilization:

Optimize resource utilization within the FPGA design to maximize performance and efficiency. Utilize hierarchical design techniques, resource sharing, and pipelining to minimize resource contention and improve overall throughput and latency.

Considerations:

When designing with 10AX115N3F45I2SGES, it's essential to consider:

- Design Constraints: Understand and adhere to the timing, area, and power constraints specified for the FPGA design to ensure proper functionality and performance.

- Design Partitioning: Partition the design into logical modules or blocks to facilitate design, simulation, and verification processes, and to enable parallel development by multiple team members.

- Design Verification: Thoroughly verify the functionality and performance of the FPGA design through simulation, emulation, and prototyping to identify and address any potential issues or bottlenecks before deployment.

- Design Reusability: Design the FPGA project with modularity and reusability in mind to facilitate future updates, modifications, and scalability for evolving project requirements.

- Documentation and Collaboration: Maintain comprehensive documentation of the FPGA design, including design specifications, block diagrams, and test plans, to facilitate collaboration among team members and ensure continuity throughout the project lifecycle.

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3. Are the 10AX115N3F45I2SGES price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115N3F45I2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N3F45I2SGES we delivered, we will accept the replacement or return of the 10AX115N3F45I2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N3F45I2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations