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Name: 10AX115N3F45I2SG
Brand: Intel
SKU: 10AX115N3F45I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115N3F45I2SG

Part No.:: 10AX115N3F45I2SG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115N3F45I2SG.pdf

Description:: IC FPGA 768 I/O 1932FCBGA

In Stock:: 3512

Quantity:: Add To Cart

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10AX115N3F45I2SG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
768
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N3F45I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N3F45I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N3F45I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N3F45I2SG information

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10AX115N3F45I2SG Application Introduction

10AX115N3F45I2SG is a Field Programmable Gate Array (FPGA) chip known for its high-performance computing capabilities and versatility in various electronic applications.

Application Scope:

In digital signal processing, 10AX115N3F45I2SG can be utilized for implementing complex algorithms, such as image processing or telecommunications signal modulation.

Design Considerations:

When integrating 10AX115N3F45I2SG into a project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of 10AX115N3F45I2SG and associated peripherals. Utilize voltage regulators and power gating techniques to achieve this objective.

2. Signal Integrity:

Pay special attention to signal integrity to maintain reliable communication between 10AX115N3F45I2SG and external components. Proper PCB layout, signal termination, and impedance matching techniques should be employed to mitigate signal degradation and reflections.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of 10AX115N3F45I2SG during operation. Utilize heat sinks, thermal vias, and proper airflow within the system enclosure to dissipate heat efficiently and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX115N3F45I2SG and other components requiring clock inputs. Use low-jitter clock sources and minimize clock skew to ensure proper functionality of timing-critical circuits.

5. Configuration Management:

Implement efficient configuration management techniques to facilitate easy programming and reconfiguration of 10AX115N3F45I2SG during development and deployment phases. Utilize non-volatile configuration memory and reliable configuration interfaces for seamless integration into the target system.

Best Practices:

To optimize the design using 10AX115N3F45I2SG, consider the following best practices:

- Modular Design: Divide the overall system into smaller functional blocks to simplify design, debugging, and maintenance tasks.

- Design for Testability: Incorporate built-in self-test (BIST) features and diagnostic capabilities to facilitate system debugging and troubleshooting.

- Resource Utilization: Optimize resource utilization of 10AX115N3F45I2SG by carefully selecting appropriate FPGA resources, such as logic elements, memory blocks, and DSP slices, to meet performance and area constraints.

- Design Verification: Perform thorough simulation and verification of the design using FPGA simulation tools and hardware-in-the-loop (HIL) testing to ensure functional correctness and reliability.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC), to facilitate successful product certification and market acceptance.

10AX115N3F45I2SG FAQ

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3. Are the 10AX115N3F45I2SG price and inventory displayed accurate?

The price and inventory of 10AX115N3F45I2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115N3F45I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N3F45I2SG we delivered, we will accept the replacement or return of the 10AX115N3F45I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N3F45I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations