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Name: 10AX115N3F45I2LG
Brand: Intel
SKU: 10AX115N3F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115N3F45I2LG

Part No.:: 10AX115N3F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX115N3F45I2LG.pdf

Description:: IC FPGA 768 I/O 1932FCBGA

In Stock:: 3490

Quantity:: Add To Cart

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10AX115N3F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
768
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N3F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N3F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N3F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N3F45I2LG information

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10AX115N3F45I2LG Application Introduction

10AX115N3F45I2LG is a versatile FPGA chip with advanced features, commonly utilized in a wide range of digital design projects for various applications. It offers high-performance processing capabilities, extensive logic resources, and flexible I/O options.

Application Scenario:

In digital signal processing applications, 10AX115N3F45I2LG can be utilized to implement complex algorithms for audio processing, image recognition, or communications systems.

Circuit Design:

To optimize the design using 10AX115N3F45I2LG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX115N3F45I2LG and associated components. Utilize voltage regulators, power gating, and dynamic voltage scaling to achieve optimal power efficiency.

2. Signal Integrity:

Pay attention to signal integrity by carefully designing PCB layouts, minimizing trace lengths, and utilizing impedance-matched transmission lines. Proper termination and decoupling capacitors should be employed to reduce signal reflections and noise.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of 10AX115N3F45I2LG. Utilize heatsinks, thermal vias, and proper airflow to dissipate heat generated during operation.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise timing and synchronization of signals within the FPGA design. Use low-skew clock distribution techniques and proper clock routing to minimize clock skew and jitter.

5. I/O Optimization:

Optimize the use of I/O resources by carefully planning pin assignments and utilizing high-speed serial transceivers for interfacing with external devices or communication interfaces. Utilize LVDS or other high-speed signaling standards for reliable data transmission.

Considerations:

When designing with 10AX115N3F45I2LG, consider the following:

- Design Validation: Perform thorough simulations and testing to verify the functionality and performance of the FPGA design under various operating conditions.

- Resource Utilization: Optimize the use of logic resources and memory blocks within the FPGA to maximize design efficiency and minimize resource wastage.

- Design Constraints: Consider timing constraints, resource utilization constraints, and other design constraints to ensure the design meets performance requirements and timing closure.

- Design Reusability: Design FPGA modules with modularity and reusability in mind to facilitate easier integration into future projects and reduce development time.

- Security Considerations: Implement security features, such as bitstream encryption and authentication, to protect sensitive design information and prevent unauthorized access or tampering.

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3. Are the 10AX115N3F45I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115N3F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N3F45I2LG we delivered, we will accept the replacement or return of the 10AX115N3F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N3F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations