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Name: 10AX115N3F40I2SG
Brand: Intel
SKU: 10AX115N3F40I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115N3F40I2SG

Part No.:: 10AX115N3F40I2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX115N3F40I2SG.pdf

Description:: IC FPGA 600 I/O 1517FCBGA

In Stock:: 2899

Quantity:: Add To Cart

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10AX115N3F40I2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115N3F40I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115N3F40I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115N3F40I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115N3F40I2SG information

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10AX115N3F40I2SG Application Introduction

10AX115N3F40I2SG is a field-programmable gate array (FPGA) device known for its high-performance capabilities and versatility in various electronic applications. It offers abundant resources for implementing complex logic functions and signal processing algorithms.

Application Scenario:

In telecommunications infrastructure, 10AX115N3F40I2SG can be utilized for tasks such as high-speed data processing, protocol handling, and traffic management in networking equipment.

Circuit Design:

To design a high-speed data processing system using 10AX115N3F40I2SG, consider the following aspects:

1. Power Management:

Implement robust power supply and management solutions to ensure stable voltage and current levels for 10AX115N3F40I2SG and associated components. Utilize high-quality voltage regulators and decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay attention to signal integrity throughout the design process. Proper PCB layout techniques, impedance matching, and signal termination are essential to maintain signal integrity and prevent data corruption or loss.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of 10AX115N3F40I2SG. Use thermal vias, heat sinks, and adequate airflow in the system enclosure to dissipate heat generated during operation.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and accurate clock signals to 10AX115N3F40I2SG and synchronized operation of all components. Utilize low-skew clock routing techniques and clock buffers to minimize clock skew and jitter.

5. Board-Level Testing:

Perform thorough board-level testing and validation to ensure the proper functioning of the 10AX115N3F40I2SG-based system. Test for signal integrity, power delivery, thermal performance, and functional correctness under various operating conditions.

Considerations:

When designing with 10AX115N3F40I2SG, consider the following optimization techniques:

- Resource Utilization: Efficiently utilize FPGA resources to minimize logic utilization and maximize performance.

- Timing Closure: Pay careful attention to timing constraints and perform timing analysis to ensure all timing requirements are met.

- Design Reusability: Modularize the design to facilitate reuse of IP cores and modules, improving development efficiency and scalability.

- Design Security: Implement security features such as bitstream encryption and authentication to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Design for Manufacturability: Consider manufacturability aspects such as PCB fabrication tolerances and assembly process requirements to ensure smooth production and reliable product quality.

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3. Are the 10AX115N3F40I2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115N3F40I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115N3F40I2SG we delivered, we will accept the replacement or return of the 10AX115N3F40I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115N3F40I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations