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Name: 10AX115H3F34I2SGES
Brand: Intel
SKU: 10AX115H3F34I2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115H3F34I2SGES

Part No.:: 10AX115H3F34I2SGES

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX115H3F34I2SGES.pdf

Description:: IC FPGA 504 I/O 1152FCBGA

In Stock:: 2813

Quantity:: Add To Cart

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10AX115H3F34I2SGES Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
504
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX115H3F34I2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115H3F34I2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115H3F34I2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115H3F34I2SGES information

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10AX115H3F34I2SGES Application Introduction

10AX115H3F34I2SGES is a versatile FPGA chip known for its high-performance computing capabilities and flexible programmability, making it suitable for a wide range of applications in digital design projects.

Application Scenario:

In digital signal processing applications, 10AX115H3F34I2SGES can be utilized to implement complex algorithms for audio or image processing, enabling real-time analysis and manipulation of digital signals.

Circuit Design:

To effectively utilize 10AX115H3F34I2SGES in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption of 10AX115H3F34I2SGES and associated components. Utilize low-dropout voltage regulators and power gating schemes for optimal power efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches, ensuring reliable signal transmission and reception. Use controlled impedance traces and proper termination techniques to maintain signal integrity, especially in high-speed interfaces.

3. Thermal Management:

Implement effective thermal management solutions, such as heatsinks, thermal vias, and airflow optimization, to dissipate heat generated by 10AX115H3F34I2SGES during operation. Ensure proper thermal coupling between the FPGA and the PCB to prevent overheating and performance degradation.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring precise timing synchronization across the FPGA and peripheral components. Use clock buffering, fanout optimization, and clock tree synthesis techniques for robust clock signal distribution.

5. Design Partitioning:

Partition the design into logical modules and utilize the FPGA's resources efficiently by mapping each module to the appropriate FPGA fabric and implementing parallel processing where applicable. Utilize hardware accelerators and optimized coding techniques to maximize performance and resource utilization.

Considerations:

When designing with 10AX115H3F34I2SGES, it's essential to consider:

- Resource Utilization: Optimize resource utilization by balancing logic, memory, and DSP usage to meet performance requirements while minimizing resource constraints.

- Timing Closure: Perform thorough timing analysis and closure to ensure that all timing constraints are met, avoiding setup and hold time violations that can affect system stability and performance.

- Design Debugging: Implement comprehensive debugging features and instrumentation within the design to facilitate debugging and verification during development and testing phases.

- Security: Incorporate security features, such as encryption, authentication, and secure boot mechanisms, to protect sensitive data and intellectual property stored within the FPGA and prevent unauthorized access or tampering.

- Compliance: Ensure compliance with industry standards and regulations relevant to your application, such as EMC/EMI standards, functional safety requirements, and cybersecurity guidelines, to ensure the reliability, safety, and security of the final product.

10AX115H3F34I2SGES FAQ

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3. Are the 10AX115H3F34I2SGES price and inventory displayed accurate?

The price and inventory of 10AX115H3F34I2SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115H3F34I2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115H3F34I2SGES we delivered, we will accept the replacement or return of the 10AX115H3F34I2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115H3F34I2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations