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Name: 10AX115H3F34E2SG
Brand: Intel
SKU: 10AX115H3F34E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115H3F34E2SG

Part No.:: 10AX115H3F34E2SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX115H3F34E2SG.pdf

Description:: IC FPGA 504 I/O 1152FBGA

In Stock:: 3877

Quantity:: Add To Cart

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10AX115H3F34E2SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
504
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115H3F34E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115H3F34E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115H3F34E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115H3F34E2SG information

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10AX115H3F34E2SG Application Introduction

10AX115H3F34E2SG is a field-programmable gate array (FPGA) known for its versatility and high-performance capabilities, commonly used in various electronic design projects for signal processing, data encryption, and high-speed communication applications.

Application Scenario:

In telecommunications infrastructure, 10AX115H3F34E2SG can be utilized to implement advanced signal processing algorithms for real-time data analysis and encryption, enhancing network security and efficiency.

Circuit Design:

To effectively integrate 10AX115H3F34E2SG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable and clean power delivery to 10AX115H3F34E2SG and associated components. Utilize voltage regulators, decoupling capacitors, and power planes to minimize noise and voltage fluctuations, ensuring reliable operation.

2. Signal Integrity:

Design the PCB layout with careful consideration of signal integrity principles to minimize signal degradation and electromagnetic interference (EMI). Use proper trace routing techniques, controlled impedance traces, and signal termination methods to maintain signal integrity and prevent data corruption.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 10AX115H3F34E2SG and prevent overheating. Incorporate heatsinks, thermal vias, and proper airflow ventilation to maintain optimal operating temperatures and ensure long-term reliability.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise and synchronized clock signals for 10AX115H3F34E2SG and connected peripherals. Use low-jitter clock sources, impedance-matched traces, and clock buffering techniques to minimize clock skew and timing errors.

5. I/O Interface:

Optimize the I/O interface design to achieve high-speed data transfer and reliable communication between 10AX115H3F34E2SG and external devices. Utilize LVDS, SERDES, or other high-speed interface standards, and carefully layout and terminate signal traces to minimize signal reflections and ensure data integrity.

Considerations:

When designing with 10AX115H3F34E2SG, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, DSP blocks, and memory, to optimize performance and minimize resource wastage.

- Timing Constraints: Analyze timing constraints and perform timing closure to ensure that design meets timing requirements and operates reliably at the desired clock frequency.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and compliance with design specifications.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and confidentiality of the FPGA design.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades or enhancements, ensuring long-term viability and flexibility of the design.

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3. Are the 10AX115H3F34E2SG price and inventory displayed accurate?

The price and inventory of 10AX115H3F34E2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX115H3F34E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115H3F34E2SG we delivered, we will accept the replacement or return of the 10AX115H3F34E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115H3F34E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations