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Name: 10AX115H1F34E1SG
Brand: Intel
SKU: 10AX115H1F34E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX115H1F34E1SG

Part No.:: 10AX115H1F34E1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX115H1F34E1SG.pdf

Description:: IC FPGA 504 I/O 1152FBGA

In Stock:: 3015

Quantity:: Add To Cart

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10AX115H1F34E1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
504
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX115H1F34E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX115H1F34E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX115H1F34E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX115H1F34E1SG information

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10AX115H1F34E1SG Application Introduction

10AX115H1F34E1SG is a field-programmable gate array (FPGA) chip manufactured by Intel, offering high performance and flexibility for various digital design projects.

Application Scope:

In digital signal processing applications, 10AX115H1F34E1SG can be utilized to implement complex algorithms for tasks such as image processing or communication protocols.

Design Considerations:

To effectively utilize 10AX115H1F34E1SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 10AX115H1F34E1SG. Utilize low-power modes when the FPGA is idle and employ dynamic voltage and frequency scaling techniques to match power consumption with processing demands.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure robust signal integrity. Utilize proper termination techniques, impedance matching, and signal isolation to prevent reflections, crosstalk, and other signal integrity issues.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 10AX115H1F34E1SG under various operating conditions. Utilize heat sinks, thermal vias, and proper airflow to dissipate heat efficiently.

4. Clocking:

Design a stable clocking architecture to provide accurate and synchronized clock signals to 10AX115H1F34E1SG and associated components. Utilize clock distribution networks, phase-locked loops (PLLs), and clock routing techniques to minimize clock skew and jitter.

5. I/O Planning:

Optimize the I/O planning to maximize the utilization of available I/O resources on 10AX115H1F34E1SG. Consider the I/O standards, voltage levels, and signal requirements of connected peripherals, and utilize advanced I/O features such as LVDS or SERDES for high-speed communication interfaces.

Design Guidelines:

When designing with 10AX115H1F34E1SG, keep in mind the following guidelines to achieve optimal performance and reliability:

- Design for Testability: Implement built-in self-test (BIST) and diagnostic features to facilitate testing and debugging of the FPGA design.

- Design for Security: Incorporate security features such as encryption, authentication, and secure boot mechanisms to protect the intellectual property and ensure the integrity of the FPGA design.

- Design for Flexibility: Utilize the reconfigurability of 10AX115H1F34E1SG to adapt the FPGA design to changing requirements and optimize resource utilization for different operating modes or applications.

- Design for Scalability: Plan the FPGA design for scalability to accommodate future enhancements or expansions, such as additional logic resources, memory, or interfaces.

- Design for Reliability: Conduct thorough functional verification, timing analysis, and reliability testing to ensure the robustness and reliability of the FPGA design under normal and extreme operating conditions.

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3. Are the 10AX115H1F34E1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX115H1F34E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX115H1F34E1SG we delivered, we will accept the replacement or return of the 10AX115H1F34E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX115H1F34E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations