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Name: 10AX090U3F45I2LG
Brand: Intel
SKU: 10AX090U3F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX090U3F45I2LG

Part No.:: 10AX090U3F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX090U3F45I2LG.pdf

Description:: IC FPGA 480 I/O 1932FCBGA

In Stock:: 2970

Quantity:: Add To Cart

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10AX090U3F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
339620
NumberofLogicElements/Cells:
900000
TotalRAMBits:
59234304
NumberofI/O:
480
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX090U3F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX090U3F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX090U3F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX090U3F45I2LG information

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10AX090U3F45I2LG Application Introduction

10AX090U3F45I2LG is a field-programmable gate array (FPGA) chip known for its high-performance computing capabilities and versatility in various electronic design applications.

Application Scenario:

In the domain of digital signal processing (DSP), 10AX090U3F45I2LG can be effectively utilized to implement complex algorithms for tasks such as image and audio processing.

Circuit Design:

To optimize the design using 10AX090U3F45I2LG, consider the following aspects:

1. Power Management:

Implement efficient power management techniques to ensure the FPGA and associated components receive stable and clean power. Use voltage regulators, decoupling capacitors, and power planes to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Utilize impedance matching techniques, controlled impedance traces, and proper grounding to maintain signal integrity and reliability.

3. Thermal Management:

Ensure adequate thermal dissipation for the 10AX090U3F45I2LG chip to prevent overheating and maintain optimal performance. Use heat sinks, thermal vias, and proper airflow in the enclosure design to dissipate heat effectively.

4. Clock Distribution:

Implement a robust clock distribution network to provide stable and synchronized clock signals to the FPGA and other components. Use low-skew clock routing techniques, clock buffers, and PLLs to minimize clock jitter and ensure reliable operation.

5. I/O Planning:

Optimize the FPGA I/O utilization and placement to minimize signal delays and meet timing constraints. Group related I/O signals, use proper termination techniques, and consider signal fanout to achieve reliable signal communication.

Considerations:

When designing with 10AX090U3F45I2LG, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to minimize resource wastage and optimize performance.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and critical paths are properly optimized.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Design for Testability: Incorporate built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of the FPGA design during development and production.

- Design Documentation: Maintain comprehensive documentation, including design specifications, schematics, and timing reports, to aid in design verification, debugging, and future maintenance.

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3. Are the 10AX090U3F45I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX090U3F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX090U3F45I2LG we delivered, we will accept the replacement or return of the 10AX090U3F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX090U3F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations