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Name: 10AX090S3F45I2SG
Brand: Intel
SKU: 10AX090S3F45I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX090S3F45I2SG

Part No.:: 10AX090S3F45I2SG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX090S3F45I2SG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 3854

Quantity:: Add To Cart

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10AX090S3F45I2SG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
339620
NumberofLogicElements/Cells:
900000
TotalRAMBits:
59234304
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX090S3F45I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX090S3F45I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX090S3F45I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX090S3F45I2SG information

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10AX090S3F45I2SG Application Introduction

10AX090S3F45I2SG is a field-programmable gate array (FPGA) with advanced features suitable for various high-performance applications. It offers a large number of configurable logic blocks, embedded memory, and high-speed transceivers.

Application Scenario:

In telecommunications infrastructure, 10AX090S3F45I2SG can be utilized to implement high-speed data processing and routing functions in networking equipment.

Circuit Design:

To effectively utilize 10AX090S3F45I2SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation of 10AX090S3F45I2SG. Utilize power gating and dynamic voltage scaling to optimize power usage based on the application's requirements.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal distortion. Use proper termination techniques, controlled impedance traces, and signal routing guidelines to mitigate signal integrity issues and ensure reliable data transmission.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure the longevity of 10AX090S3F45I2SG. Utilize thermal vias, heat sinks, and airflow optimization techniques to dissipate heat efficiently and maintain the FPGA's operating temperature within acceptable limits.

4. Clocking:

Implement robust clocking architectures to ensure synchronous operation and minimize clock skew in 10AX090S3F45I2SG-based designs. Use dedicated clock distribution networks, PLLs, and clock domain crossing techniques to synchronize clocks accurately and maintain timing integrity.

5. Design Verification:

Conduct thorough design verification and validation testing to ensure the reliability and functionality of the 10AX090S3F45I2SG-based system. Perform simulation, emulation, and hardware testing to validate the design against performance specifications and functional requirements.

Considerations:

When optimizing the design with 10AX090S3F45I2SG, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic cells, memory blocks, and DSP slices, to maximize performance and minimize resource constraints.

- Timing Closure: Ensure timing closure by analyzing and optimizing critical paths to meet timing requirements and achieve reliable operation at the target clock frequency.

- Design Partitioning: Partition the design into manageable modules to facilitate design reuse, scalability, and easier debugging and maintenance.

- Security: Implement security features, such as bitstream encryption and secure boot mechanisms, to protect the intellectual property and ensure the integrity of the FPGA configuration.

- Compliance: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards for electronic devices.

10AX090S3F45I2SG FAQ

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3. Are the 10AX090S3F45I2SG price and inventory displayed accurate?

The price and inventory of 10AX090S3F45I2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX090S3F45I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX090S3F45I2SG we delivered, we will accept the replacement or return of the 10AX090S3F45I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX090S3F45I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations