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Name: 10AX090S2F45I2LG
Brand: Intel
SKU: 10AX090S2F45I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX090S2F45I2LG

Part No.:: 10AX090S2F45I2LG

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AX090S2F45I2LG.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 3496

Quantity:: Add To Cart

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10AX090S2F45I2LG Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
339620
NumberofLogicElements/Cells:
900000
TotalRAMBits:
59234304
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX090S2F45I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX090S2F45I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX090S2F45I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX090S2F45I2LG information

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10AX090S2F45I2LG Application Introduction

10AX090S2F45I2LG is a field-programmable gate array (FPGA) with advanced features, commonly used in high-performance computing and telecommunications applications. It offers high logic capacity, versatile I/O capabilities, and efficient power management.

Application Scenario:

In telecommunications infrastructure, 10AX090S2F45I2LG can be utilized for signal processing tasks, such as digital signal modulation and demodulation in wireless communication systems.

Design Optimization:

To optimize the design using 10AX090S2F45I2LG, consider the following techniques:

1. Power Management:

Implement dynamic power management techniques, such as clock gating and voltage scaling, to minimize power consumption during idle or low activity periods. Utilize the built-in power management features of 10AX090S2F45I2LG to adjust voltage and frequency dynamically based on the workload.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout to minimize signal reflections, crosstalk, and impedance mismatches. Use controlled impedance traces for high-speed interfaces and incorporate termination resistors to eliminate signal reflections.

3. Thermal Management:

Implement effective thermal management techniques to dissipate heat generated by 10AX090S2F45I2LG and other components. Utilize heat sinks, thermal vias, and fans to maintain the FPGA's operating temperature within the specified limits and prevent thermal throttling.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter. Use clock tree synthesis tools to generate balanced clock trees with minimal skew, and place clock buffers strategically to minimize clock routing delays.

5. I/O Optimization:

Maximize the utilization of 10AX090S2F45I2LG's versatile I/O resources by carefully planning the I/O placement and routing. Group related I/O interfaces together to minimize signal routing congestion and ensure optimal signal integrity.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Optimize the FPGA resource utilization to maximize performance and minimize resource wastage.

- Timing Closure: Ensure timing closure by carefully analyzing timing constraints and optimizing the design to meet timing requirements.

- Design Partitioning: Partition the design into smaller, manageable modules to facilitate easier implementation and debugging.

- Design Verification: Thoroughly verify the design using simulation and emulation techniques to ensure correct functionality and performance before deployment.

- Design Documentation: Maintain comprehensive documentation detailing the design specifications, constraints, and implementation details for future reference and debugging.

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3. Are the 10AX090S2F45I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX090S2F45I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX090S2F45I2LG we delivered, we will accept the replacement or return of the 10AX090S2F45I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX090S2F45I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations