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Name: 10AX090N3F40I2LG
Brand: Intel
SKU: 10AX090N3F40I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX090N3F40I2LG

Part No.:: 10AX090N3F40I2LG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX090N3F40I2LG.pdf

Description:: IC FPGA 600 I/O 1517FCBGA

In Stock:: 3658

Quantity:: Add To Cart

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10AX090N3F40I2LG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
339620
NumberofLogicElements/Cells:
900000
TotalRAMBits:
59234304
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX090N3F40I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX090N3F40I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX090N3F40I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX090N3F40I2LG information

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10AX090N3F40I2LG Application Introduction

10AX090N3F40I2LG is a field-programmable gate array (FPGA) chip manufactured by Intel. It offers high-performance logic integration and flexibility, making it suitable for a wide range of applications in embedded systems, telecommunications, and data processing.

Application Scenario:

In digital signal processing (DSP) applications, 10AX090N3F40I2LG can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, and communications protocols.

Circuit Design:

To effectively utilize 10AX090N3F40I2LG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and maximize battery life. Utilize power gating techniques and low-power modes available in 10AX090N3F40I2LG to dynamically adjust power usage based on system workload.

2. Signal Integrity:

Design PCB layouts with controlled impedance traces and proper signal termination to ensure signal integrity in high-speed interfaces. Pay attention to signal routing and minimize signal reflections to maintain reliable communication with external devices.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 10AX090N3F40I2LG during operation. Utilize thermal vias, heatsinks, and fans to maintain the chip temperature within safe operating limits and prevent performance degradation or failure.

4. Clock Distribution:

Optimize clock distribution networks to minimize clock skew and jitter, ensuring synchronous operation of various components in the system. Use clock buffers and phase-locked loops (PLLs) to generate stable clock signals and synchronize timing across different parts of the design.

5. Resource Utilization:

Maximize the utilization of logic resources, memory blocks, and DSP slices available in 10AX090N3F40I2LG to achieve optimal performance and efficiency. Employ efficient coding techniques and utilize built-in intellectual property (IP) cores for common functions to reduce design complexity and development time.

Considerations:

When designing with 10AX090N3F40I2LG, it's important to consider:

- Timing Constraints: Ensure that timing constraints are properly defined and met to prevent timing violations and ensure reliable operation of the design.

- Design Iteration: Iteratively simulate, synthesize, and verify the design to identify and address potential issues early in the development process, reducing time-to-market and improving overall design quality.

- Security: Implement security features, such as bitstream encryption and secure boot mechanisms, to protect the intellectual property and sensitive data stored in 10AX090N3F40I2LG from unauthorized access or tampering.

- Environmental Considerations: Consider environmental factors, such as temperature, humidity, and vibration, and design the system to withstand harsh operating conditions encountered in real-world deployment scenarios.

- Compliance: Ensure that the design complies with relevant industry standards and regulations, such as FCC for electromagnetic compatibility (EMC) and safety standards for reliable operation and market acceptance.

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3. Are the 10AX090N3F40I2LG price and inventory displayed accurate?

The price and inventory of 10AX090N3F40I2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX090N3F40I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX090N3F40I2LG we delivered, we will accept the replacement or return of the 10AX090N3F40I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX090N3F40I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations