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Name: 10AX090H3F34E2LG
Brand: Intel
SKU: 10AX090H3F34E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX090H3F34E2LG

Part No.:: 10AX090H3F34E2LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX090H3F34E2LG.pdf

Description:: IC FPGA 504 I/O 1152FBGA

In Stock:: 3683

Quantity:: Add To Cart

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10AX090H3F34E2LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
339620
NumberofLogicElements/Cells:
900000
TotalRAMBits:
59234304
NumberofI/O:
504
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX090H3F34E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX090H3F34E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX090H3F34E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX090H3F34E2LG information

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10AX090H3F34E2LG Application Introduction

10AX090H3F34E2LG is a field-programmable gate array (FPGA) device manufactured by Intel (formerly Altera), featuring high logic density and powerful processing capabilities, suitable for a wide range of applications in embedded systems, telecommunications, and high-performance computing.

Application Scenario:

In a digital signal processing application, 10AX090H3F34E2LG can be utilized to implement complex algorithms for audio or image processing in real-time, providing high-speed computation and flexibility.

Circuit Design:

To effectively utilize 10AX090H3F34E2LG in a digital signal processing project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable and clean power delivery to the 10AX090H3F34E2LG device and associated components. Utilize low-dropout regulators (LDOs) and bypass capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay attention to signal integrity by properly routing high-speed digital signals and minimizing signal reflections and crosstalk. Utilize impedance matching techniques and controlled-impedance PCB traces for critical signal paths connected to the 10AX090H3F34E2LG.

3. Thermal Management:

Manage heat dissipation effectively to prevent overheating of the 10AX090H3F34E2LG device, which can degrade performance and reliability. Use thermal vias, heatsinks, and proper airflow in the system design to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and stable clock signals to the 10AX090H3F34E2LG device and synchronize various components in the system. Minimize clock skew and jitter by careful layout and routing of clock traces.

5. System Integration:

Integrate the 10AX090H3F34E2LG device seamlessly into the overall system architecture, considering compatibility with other components and interfaces. Plan for efficient data exchange and interfacing with external peripherals or memory modules.

Considerations:

When optimizing the design for 10AX090H3F34E2LG, keep the following considerations in mind:

- Resource Utilization: Optimize FPGA resource utilization by employing efficient coding practices and resource sharing techniques to maximize performance and minimize resource conflicts.

- Timing Closure: Ensure timing closure by carefully analyzing and optimizing critical paths in the design to meet timing constraints and achieve desired performance targets.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to identify and resolve potential issues early in the development process, ensuring a reliable and robust system implementation.

- Design Documentation: Maintain comprehensive documentation of the design including schematics, layouts, constraints, and firmware/software code to facilitate future revisions, debugging, and troubleshooting.

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3. Are the 10AX090H3F34E2LG price and inventory displayed accurate?

The price and inventory of 10AX090H3F34E2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX090H3F34E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX090H3F34E2LG we delivered, we will accept the replacement or return of the 10AX090H3F34E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX090H3F34E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations