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Name: 10AX066N2F40E2SG
Brand: Intel
SKU: 10AX066N2F40E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066N2F40E2SG

Part No.:: 10AX066N2F40E2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX066N2F40E2SG.pdf

Description:: IC FPGA 588 I/O 1517FBGA

In Stock:: 2494

Quantity:: Add To Cart

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10AX066N2F40E2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
588
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX066N2F40E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066N2F40E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066N2F40E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066N2F40E2SG information

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10AX066N2F40E2SG Application Introduction

10AX066N2F40E2SG is a field-programmable gate array (FPGA) with advanced features, widely used in various electronic design projects for its versatility and performance.

Application Scenario:

In digital signal processing applications, 10AX066N2F40E2SG can be utilized for real-time data processing, such as in radar systems for target detection and tracking.

Circuit Design:

To effectively incorporate 10AX066N2F40E2SG into your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of 10AX066N2F40E2SG and associated components. Utilize voltage regulators and power monitoring circuits to maintain optimal voltage levels and prevent overloading.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and maintain signal integrity. Follow best practices for high-speed digital design, including proper ground and power plane separation, controlled impedance traces, and signal isolation techniques.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure long-term reliability of 10AX066N2F40E2SG. Utilize heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat efficiently.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring accurate timing for synchronous operations within 10AX066N2F40E2SG. Use low-skew clock buffers and proper termination techniques for stable clock signals.

5. I/O Interface:

Design robust I/O interfaces to ensure reliable communication between 10AX066N2F40E2SG and external devices. Follow recommended guidelines for signal voltage levels, impedance matching, and ESD protection to prevent damage and ensure signal integrity.

Considerations:

When optimizing the design with 10AX066N2F40E2SG, keep the following factors in mind:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to maximize performance and minimize resource conflicts.

- Design Constraints: Adhere to timing constraints and resource limitations specified by the FPGA datasheet to ensure proper functionality and avoid timing violations.

- Testing and Validation: Thoroughly test the design under various operating conditions to verify functionality, performance, and reliability. Use simulation tools and hardware validation platforms for comprehensive testing.

- Firmware Development: Develop optimized firmware or HDL code to leverage the full capabilities of 10AX066N2F40E2SG and implement complex algorithms efficiently.

- Documentation: Maintain detailed documentation of the design, including schematics, PCB layouts, firmware source code, and test procedures, to facilitate troubleshooting and future revisions.

10AX066N2F40E2SG FAQ

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3. Are the 10AX066N2F40E2SG price and inventory displayed accurate?

The price and inventory of 10AX066N2F40E2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX066N2F40E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066N2F40E2SG we delivered, we will accept the replacement or return of the 10AX066N2F40E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066N2F40E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations