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Name: 10AX066N2F40E1SG
Brand: Intel
SKU: 10AX066N2F40E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066N2F40E1SG

Part No.:: 10AX066N2F40E1SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX066N2F40E1SG.pdf

Description:: IC FPGA 588 I/O 1517FCBGA

In Stock:: 3941

Quantity:: Add To Cart

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10AX066N2F40E1SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
588
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX066N2F40E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066N2F40E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066N2F40E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066N2F40E1SG information

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10AX066N2F40E1SG Application Introduction

10AX066N2F40E1SG is a Field-Programmable Gate Array (FPGA) chip renowned for its versatility and high performance, commonly utilized in a wide range of electronic design projects.

Application Scenario:

In telecommunications infrastructure, 10AX066N2F40E1SG can be employed for tasks such as signal processing and protocol handling in base station equipment.

Circuit Design:

To optimize the design using 10AX066N2F40E1SG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of 10AX066N2F40E1SG. Utilize low-dropout voltage regulators and power gating techniques to manage power domains effectively.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal degradation. Utilize techniques such as controlled impedance routing, proper ground plane design, and signal isolation to mitigate signal integrity issues.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of 10AX066N2F40E1SG and ensure reliable operation. Utilize thermal vias, heat sinks, and proper airflow within the enclosure to dissipate heat efficiently.

4. Clock Distribution:

Implement a robust clock distribution scheme to provide stable and synchronized clock signals to 10AX066N2F40E1SG and other components. Utilize clock buffers, phase-locked loops (PLLs), and clock tree synthesis techniques to optimize clock distribution.

5. I/O Planning:

Plan the I/O placement carefully to minimize signal skew and ensure optimal signal integrity. Group related I/Os together and consider factors such as signal timing, routing length, and fanout during I/O planning.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize performance and efficiency.

- Timing Closure: Ensure timing closure by carefully analyzing timing constraints, critical paths, and interconnect delays during the design process.

- Design Constraints: Consider design constraints such as power budget, size constraints, and cost targets when optimizing the design using 10AX066N2F40E1SG.

- Validation and Testing: Thoroughly validate and test the design using simulation tools, prototyping, and verification techniques to ensure functionality, performance, and reliability.

- Design Reusability: Design the system with modularity and reusability in mind to facilitate future upgrades, modifications, and reuse of intellectual property (IP) cores.

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6. What is the process for return or replacement of 10AX066N2F40E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066N2F40E1SG we delivered, we will accept the replacement or return of the 10AX066N2F40E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066N2F40E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations