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Name: 10AX066K4F40I3LG
Brand: Intel
SKU: 10AX066K4F40I3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066K4F40I3LG

Part No.:: 10AX066K4F40I3LG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX066K4F40I3LG.pdf

Description:: IC FPGA 696 I/O 1517FBGA

In Stock:: 3897

Quantity:: Add To Cart

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10AX066K4F40I3LG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
696
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX066K4F40I3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066K4F40I3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066K4F40I3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066K4F40I3LG information

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10AX066K4F40I3LG Application Introduction

10AX066K4F40I3LG is a Field-Programmable Gate Array (FPGA) chip known for its high-performance computing capabilities and versatility in various electronic design applications.

Application Scenario:

In digital signal processing applications, 10AX066K4F40I3LG can be utilized to implement complex algorithms for audio and video processing, communications, and image processing tasks.

Circuit Design:

To effectively use 10AX066K4F40I3LG in your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and prolong the battery life in portable devices. Utilize power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) techniques to minimize power consumption during idle and low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure signal integrity. Utilize impedance matching techniques, minimize trace length, and employ proper decoupling capacitors to reduce noise and ensure reliable signal transmission between the FPGA and external components.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation of 10AX066K4F40I3LG under all operating conditions. Incorporate heatsinks, thermal vias, and fans to dissipate heat generated during operation and maintain the FPGA's temperature within the recommended operating range.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and ensure synchronous operation of all internal logic elements. Utilize clock tree synthesis (CTS) techniques, implement clock buffers, and carefully route clock signals to minimize clock uncertainties and timing violations.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate design reuse, parallel development, and easier debugging. Utilize hierarchical design methodologies, identify critical paths, and optimize resource utilization to maximize FPGA performance and efficiency.

Considerations:

When designing with 10AX066K4F40I3LG, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize cost.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met and the design operates reliably at the desired clock frequency.

- Design Constraints: Consider physical constraints such as board size, pin placement, and routing complexity when designing the PCB layout and interfacing with external components.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to ensure functional correctness, performance, and reliability before fabrication and deployment.

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3. Are the 10AX066K4F40I3LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX066K4F40I3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066K4F40I3LG we delivered, we will accept the replacement or return of the 10AX066K4F40I3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066K4F40I3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations