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Name: 10AX066K4F35E3SG
Brand: Intel
SKU: 10AX066K4F35E3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066K4F35E3SG

Part No.:: 10AX066K4F35E3SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX066K4F35E3SG.pdf

Description:: IC FPGA 396 I/O 1152FBGA

In Stock:: 2227

Quantity:: Add To Cart

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10AX066K4F35E3SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX066K4F35E3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066K4F35E3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066K4F35E3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066K4F35E3SG information

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10AX066K4F35E3SG Application Introduction

10AX066K4F35E3SG is a Field-Programmable Gate Array (FPGA) device manufactured by Intel. It offers high-performance programmable logic capabilities, making it suitable for a wide range of applications, from telecommunications to industrial automation.

Application Scenario:

In a telecommunications infrastructure, 10AX066K4F35E3SG can be utilized to implement signal processing algorithms for data transmission and reception, enabling efficient communication protocols in networking equipment.

Circuit Design:

To design a signal processing system using 10AX066K4F35E3SG, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 10AX066K4F35E3SG and associated components. Utilize low-dropout voltage regulators and power gating techniques to achieve optimal power efficiency.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout and minimizing signal reflections, crosstalk, and transmission line effects. Use impedance-controlled traces and proper termination techniques to maintain signal integrity, especially in high-speed data transmission applications.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated during operation and prevent overheating of 10AX066K4F35E3SG. Use thermal vias, heatsinks, and airflow optimization techniques to maintain the device within safe operating temperatures and ensure long-term reliability.

4. Clock Distribution:

Design a robust clock distribution network to ensure reliable clocking of 10AX066K4F35E3SG and synchronous operation of the system. Use low-skew clock buffers, proper termination, and clock tree optimization techniques to minimize clock skew and jitter, enhancing overall system performance.

5. I/O Planning:

Optimize I/O planning to maximize the utilization of 10AX066K4F35E3SG resources and minimize signal routing congestion. Use advanced I/O placement and assignment algorithms to optimize signal routing paths and reduce signal propagation delays, improving system efficiency and timing closure.

Considerations:

When designing with 10AX066K4F35E3SG, it's crucial to consider:

- Design Constraints: Understand the device specifications, including resource utilization, timing constraints, and I/O requirements, to optimize the design accordingly.

- Design Validation: Perform thorough simulation and verification to ensure the design meets performance requirements and functional specifications before deployment.

- Design Iteration: Iterate the design process to fine-tune parameters and optimize performance, considering factors such as power consumption, signal integrity, and thermal management.

- Future Scalability: Design the system with scalability in mind, allowing for future upgrades and expansions to accommodate evolving application requirements and technological advancements.

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3. Are the 10AX066K4F35E3SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX066K4F35E3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066K4F35E3SG we delivered, we will accept the replacement or return of the 10AX066K4F35E3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066K4F35E3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations