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Name: 10AX066K2F35I2SGES
Brand: Intel
SKU: 10AX066K2F35I2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 10AX066K2F35I2SGES

Part No.:: 10AX066K2F35I2SGES

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX066K2F35I2SGES.pdf

Description:: IC FPGA 396 I/O 1152FCBGA

In Stock:: 2730

Quantity:: Add To Cart

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10AX066K2F35I2SGES Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX066K2F35I2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066K2F35I2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066K2F35I2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066K2F35I2SGES information

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10AX066K2F35I2SGES Application Introduction

10AX066K2F35I2SGES is a field-programmable gate array (FPGA) manufactured by Intel, offering high-performance logic, memory, and DSP capabilities for diverse applications.

Application Scenario:

In digital signal processing (DSP) applications, 10AX066K2F35I2SGES can be utilized for real-time data processing tasks, such as image or audio processing in multimedia systems.

Circuit Design:

To design a DSP system using 10AX066K2F35I2SGES, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure optimal power utilization and minimize power consumption of 10AX066K2F35I2SGES and associated components. Utilize low-dropout voltage regulators and power gating strategies to achieve power efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches. Utilize impedance matching techniques, controlled impedance traces, and proper grounding strategies to maintain signal integrity and ensure reliable data transmission.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and maintain reliable operation of 10AX066K2F35I2SGES under varying operating conditions. Incorporate heat sinks, thermal vias, and proper airflow in the system design to dissipate heat efficiently and prevent thermal throttling.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring synchronous operation of 10AX066K2F35I2SGES and synchronized data processing. Utilize clock buffering, clock tree synthesis, and proper termination techniques to maintain signal integrity and timing accuracy.

5. I/O Planning:

Plan the I/O placement and routing carefully to minimize signal delays and optimize performance. Utilize high-speed transceivers, LVDS signaling, and differential routing for high-speed data interfaces to achieve reliable data transfer and minimize electromagnetic interference.

Considerations:

When optimizing the design, consider factors such as:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize resource contention.

- Timing Closure: Ensure timing closure by carefully managing clock domains, asynchronous interfaces, and timing constraints to meet design requirements.

- Design Security: Implement design security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering.

- Design Validation: Perform thorough functional verification and validation to ensure the design meets performance, reliability, and functional requirements before deployment.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades or expansion, considering factors such as I/O bandwidth, memory capacity, and processing capability.

10AX066K2F35I2SGES FAQ

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3. Are the 10AX066K2F35I2SGES price and inventory displayed accurate?

The price and inventory of 10AX066K2F35I2SGES fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX066K2F35I2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066K2F35I2SGES we delivered, we will accept the replacement or return of the 10AX066K2F35I2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066K2F35I2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations