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Name: 10AX066K2F35I2SG
Brand: Intel
SKU: 10AX066K2F35I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066K2F35I2SG

Part No.:: 10AX066K2F35I2SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX066K2F35I2SG.pdf

Description:: IC FPGA 396 I/O 1152FBGA

In Stock:: 3972

Quantity:: Add To Cart

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10AX066K2F35I2SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX066K2F35I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066K2F35I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066K2F35I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066K2F35I2SG information

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10AX066K2F35I2SG Application Introduction

10AX066K2F35I2SG is a field-programmable gate array (FPGA) chip manufactured by Intel, featuring high-performance logic and DSP capabilities, commonly used in a variety of applications ranging from telecommunications to industrial automation.

Application Scenario:

In digital signal processing applications, 10AX066K2F35I2SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX066K2F35I2SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption and prolong battery life, especially in portable or battery-powered devices utilizing 10AX066K2F35I2SG. Utilize power gating techniques and low-power modes to minimize static and dynamic power consumption.

2. Signal Integrity:

Pay close attention to signal integrity considerations to ensure reliable data transmission and minimize signal distortion. Employ techniques such as impedance matching, signal termination, and controlled impedance routing to mitigate signal integrity issues, especially in high-speed interfaces interfacing with 10AX066K2F35I2SG.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure reliable operation of 10AX066K2F35I2SG under extended use or high workload conditions. Utilize proper heat sinking, thermal vias, and airflow optimization to dissipate heat efficiently and maintain the FPGA's operating temperature within safe limits.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise timing and synchronization of signals within the FPGA design. Utilize low-skew clock routing techniques, clock buffers, and phase-locked loops (PLLs) to maintain clock integrity and minimize clock skew, especially in multi-clock domain designs utilizing 10AX066K2F35I2SG.

5. Design Partitioning:

Partition the FPGA design into logical modules or blocks to facilitate easier design implementation, testing, and debugging. Utilize hierarchical design methodologies and design reuse techniques to improve design scalability and maintainability, especially in large-scale projects involving 10AX066K2F35I2SG.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize resource conflicts within the design.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet design performance requirements.

- Design Constraints: Adhere to design constraints such as maximum operating frequency, setup and hold times, and resource utilization constraints to ensure design functionality and reliability.

- Design Verification: Implement comprehensive design verification methodologies, including simulation, formal verification, and hardware-in-the-loop testing, to ensure design correctness and robustness before deployment.

- Design Security: Implement appropriate security measures, such as bitstream encryption and secure booting mechanisms, to protect the FPGA design from unauthorized access and tampering.

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3. Are the 10AX066K2F35I2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX066K2F35I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066K2F35I2SG we delivered, we will accept the replacement or return of the 10AX066K2F35I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066K2F35I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations