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Name: 10AX066K1F35I1HG
Brand: Intel
SKU: 10AX066K1F35I1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX066K1F35I1HG

Part No.:: 10AX066K1F35I1HG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX066K1F35I1HG.pdf

Description:: IC FPGA 492 I/O 1152FBGA

In Stock:: 2807

Quantity:: Add To Cart

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10AX066K1F35I1HG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
250540
NumberofLogicElements/Cells:
660000
TotalRAMBits:
49610752
NumberofI/O:
492
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX066K1F35I1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066K1F35I1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066K1F35I1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX066K1F35I1HG information

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10AX066K1F35I1HG Application Introduction

10AX066K1F35I1HG is a Field-Programmable Gate Array (FPGA) with advanced capabilities, commonly used in high-performance computing, communications, and signal processing applications.

Application Scenario:

In telecommunications infrastructure, 10AX066K1F35I1HG can be utilized to implement complex signal processing algorithms for tasks such as baseband processing in wireless communication systems.

Circuit Design:

To effectively utilize 10AX066K1F35I1HG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption of 10AX066K1F35I1HG and associated components. Utilize low-dropout voltage regulators and power gating strategies to optimize power efficiency.

2. Signal Integrity:

Design the PCB layout to minimize signal reflections, crosstalk, and electromagnetic interference. Utilize impedance matching techniques, controlled impedance traces, and proper ground/power plane design to maintain signal integrity and minimize noise.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating and maintain reliable operation of 10AX066K1F35I1HG. Utilize thermal vias, heat sinks, and proper airflow design to dissipate heat generated during operation.

4. Clock Distribution:

Optimize clock distribution to ensure accurate timing and synchronization within the FPGA design. Implement clock buffering, clock tree synthesis, and clock skew minimization techniques to maintain signal integrity and improve system performance.

5. Configuration Management:

Implement secure and reliable FPGA configuration management strategies to ensure proper initialization and operation of 10AX066K1F35I1HG. Utilize techniques such as partial reconfiguration, configuration scrubbing, and secure boot to enhance system reliability and security.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Efficiently utilize FPGA resources to minimize area utilization and maximize performance.

- Timing Closure: Perform timing analysis and optimization to ensure that design meets timing constraints and achieves desired performance targets.

- Design Modularity: Partition the design into smaller, modular blocks to facilitate design reuse, debugging, and scalability.

- Testability: Implement built-in self-test (BIST) and debug features to facilitate design verification and debugging during development and deployment.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to the application domain, such as PCI Express, Ethernet, or DDR memory standards.

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3. Are the 10AX066K1F35I1HG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX066K1F35I1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066K1F35I1HG we delivered, we will accept the replacement or return of the 10AX066K1F35I1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX066K1F35I1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations