10AX066H3F34I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX066H3F34I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX066H3F34I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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Key Features:
- High-Performance: Supports data rates up to 28.3 Gbps for high-speed communication.
- High Capacity: Offers up to 660K logic elements for complex logic implementation.
- Integrated DSP Blocks: Contains 1,504 18x19 multipliers for signal processing.
- Memory Interfaces: Supports DDR4, QDR IV, and RLDRAM 3 for high-speed memory access.
Application Scenario: High-Speed Data Communication
In a high-speed data communication application, the 10AX066H3F34I2SG can be used as the central processing unit for data routing and signal processing.
Circuit Connection Details:
- Power Supply: Connect VCC and GND pins to a stable power source. For this FPGA, multiple power supply voltages are required (e.g., 1.2V for core, 2.5V for I/O).
- Clock Source: Connect a high-precision clock source to the dedicated clock input pins (e.g., CLK0, CLK1) to provide a stable clock signal for the 10AX066H3F34I2SG FPGA's internal operations.
- JTAG Interface: For programming and debugging, connect the following JTAG pins:
1. TDI (Test Data In): Pin 12
2. TDO (Test Data Out): Pin 14
3. TCK (Test Clock): Pin 16
4. TMS (Test Mode Select): Pin 18
- High-Speed Transceivers: Connect the transceiver pins (e.g., TX, RX) to the external communication interface for data transmission and reception.
- I/O Pins: Connect the 10AX066H3F34I2SG FPGA's I/O pins to other components in the system for data exchange. Ensure proper voltage levels and impedance matching.
Design Considerations:
- Power Management: Ensure stable and clean power supply for all voltage rails. Use decoupling capacitors near power pins to filter noise.
- Thermal Management: Implement adequate cooling solutions to dissipate heat generated by the FPGA during operation.
- Signal Integrity: Design the PCB layout carefully to minimize crosstalk and electromagnetic interference, especially for high-speed signals.
- Programming and Configuration: Choose a suitable configuration method (e.g., JTAG, Active Serial) and ensure reliable programming interfaces.
In summary, the 10AX066H3F34I2SG FPGA is a powerful component for high-speed data communication applications. Proper circuit design, power management, and signal integrity considerations are crucial for optimal performance.
Packaging and Pinout for 10AX066H3F34I2SG
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX066H3F34I2SG we delivered, we will accept the replacement or return of the 10AX066H3F34I2SG only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of 10AX066H3F34I2SG.
(3)The PartNo is unused and only in the original unpacked packaging.
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(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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