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Name: 10AX057N2F40E2SG
Brand: Intel
SKU: 10AX057N2F40E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057N2F40E2SG

Part No.:: 10AX057N2F40E2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX057N2F40E2SG.pdf

Description:: IC FPGA 588 I/O 1517FBGA

In Stock:: 2310

Quantity:: Add To Cart

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10AX057N2F40E2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
588
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX057N2F40E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057N2F40E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057N2F40E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057N2F40E2SG information

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10AX057N2F40E2SG Application Introduction

10AX057N2F40E2SG is a field-programmable gate array (FPGA) chip designed by Intel, offering high performance and flexibility for a wide range of applications in digital logic design and signal processing.

Application Scenario:

In telecommunications infrastructure, 10AX057N2F40E2SG can be utilized to implement advanced signal processing algorithms for tasks such as channel coding and modulation in wireless communication systems.

Circuit Design:

To design a signal processing system using 10AX057N2F40E2SG, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption of 10AX057N2F40E2SG and associated peripherals. Utilize power gating and dynamic voltage scaling to minimize power dissipation during both active and standby modes.

2. Signal Integrity:

Design the PCB layout to minimize signal propagation delays and reduce signal reflections and crosstalk. Use impedance matching techniques and carefully route high-speed signal traces to maintain signal integrity and minimize timing errors.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX057N2F40E2SG to prevent overheating and ensure reliable operation. Incorporate heat sinks, thermal vias, and airflow management techniques to maintain the chip temperature within safe limits.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and connected peripherals. Use low-skew clock distribution networks and proper clock termination techniques to maintain signal integrity and timing accuracy.

5. Design Partitioning:

Partition the design into smaller functional blocks to facilitate design reuse and optimization. Utilize hierarchical design methodologies and IP core integration to streamline development and improve design scalability and maintainability.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Efficiently utilize the resources available in 10AX057N2F40E2SG to minimize area and power consumption while meeting performance requirements.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet the required performance constraints.

- Design Validation: Validate the design using simulation and emulation techniques to verify functionality, performance, and compliance with specifications.

- Security: Implement security measures, such as bitstream encryption and secure boot mechanisms, to protect the intellectual property and ensure system integrity.

- Design Iteration: Iterate the design process to fine-tune performance, optimize resource utilization, and address any design constraints or requirements.

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3. Are the 10AX057N2F40E2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX057N2F40E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX057N2F40E2SG we delivered, we will accept the replacement or return of the 10AX057N2F40E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057N2F40E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations