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Name: 10AX057K4F35I3SG
Brand: Intel
SKU: 10AX057K4F35I3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057K4F35I3SG

Part No.:: 10AX057K4F35I3SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX057K4F35I3SG.pdf

Description:: IC FPGA 396 I/O 1152FBGA

In Stock:: 2152

Quantity:: Add To Cart

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10AX057K4F35I3SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX057K4F35I3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057K4F35I3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057K4F35I3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057K4F35I3SG information

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10AX057K4F35I3SG Application Introduction

10AX057K4F35I3SG is a versatile FPGA (Field-Programmable Gate Array) device commonly used in various electronic design projects for its flexibility and reconfigurability.

Application Scenario:

In a digital signal processing project, 10AX057K4F35I3SG can be utilized to implement complex algorithms for audio processing, image processing, or communication systems.

Circuit Design:

To optimize the design with 10AX057K4F35I3SG, consider the following techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption. Utilize power gating, dynamic voltage scaling, and low-power standby modes to enhance energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference, crosstalk, and impedance mismatches. Use differential signaling, impedance control, and proper grounding techniques to maintain signal integrity and reliability.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation of 10AX057K4F35I3SG. Use heat sinks, thermal vias, and proper airflow design to dissipate heat efficiently and maintain optimal operating temperatures.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and connected components. Use PLLs (Phase-Locked Loops) for clock generation and distribution to achieve precise timing control.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate design verification, testing, and maintenance. Utilize hierarchical design methodologies and IP (Intellectual Property) cores to improve design scalability and reusability.

Considerations:

When optimizing the design with 10AX057K4F35I3SG, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to minimize logic cell usage and maximize design efficiency.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met, preventing timing violations and ensuring reliable operation.

- Design Constraints: Consider design constraints such as I/O standards, pin assignments, and package constraints to ensure compatibility and interoperability with other system components.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the FPGA configuration and intellectual property from unauthorized access and tampering.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototype testing to ensure functional correctness, performance, and reliability before deployment.

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6. What is the process for return or replacement of 10AX057K4F35I3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX057K4F35I3SG we delivered, we will accept the replacement or return of the 10AX057K4F35I3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057K4F35I3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations