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Name: 10AX057K3F40E2SG
Brand: Intel
SKU: 10AX057K3F40E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057K3F40E2SG

Part No.:: 10AX057K3F40E2SG

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AX057K3F40E2SG.pdf

Description:: IC FPGA 696 I/O 1517FCBGA

In Stock:: 2933

Quantity:: Add To Cart

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10AX057K3F40E2SG Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
696
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX057K3F40E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057K3F40E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057K3F40E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057K3F40E2SG information

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10AX057K3F40E2SG Application Introduction

10AX057K3F40E2SG is a Field-Programmable Gate Array (FPGA) chip known for its versatility and performance, commonly utilized in a variety of digital design projects across different industries.

Application Scenario:

In digital signal processing applications, 10AX057K3F40E2SG can be effectively used to implement complex algorithms for tasks such as image processing or communication protocols handling.

Circuit Design:

To optimize the design utilizing 10AX057K3F40E2SG, consider the following techniques:

1. Power Management:

Implement efficient power supply solutions to ensure stable voltage and current levels for 10AX057K3F40E2SG and associated components. Utilize voltage regulators, decoupling capacitors, and power planes to minimize noise and maximize reliability.

2. Signal Integrity:

Design the PCB layout carefully, paying attention to signal routing, impedance matching, and minimizing signal reflections. Utilize differential signaling where applicable and incorporate termination techniques to maintain signal integrity.

3. Thermal Management:

Optimize the thermal design to ensure 10AX057K3F40E2SG operates within its specified temperature range. Use thermal vias, heat sinks, or fans for effective heat dissipation, especially in high-performance or high-temperature environments.

4. Clock Distribution:

Implement a robust clock distribution network to ensure precise timing synchronization across the FPGA and associated components. Use low-skew routing techniques and dedicated clock routing resources to minimize clock skew and jitter.

5. Design for Testability:

Incorporate built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of the design. Utilize boundary scan (JTAG) and on-chip instrumentation to verify functionality and diagnose issues during development and production.

Considerations:

When optimizing the design, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize the resources available on 10AX057K3F40E2SG to minimize area usage and maximize performance.

- Timing Closure: Pay attention to timing constraints and ensure the design meets timing requirements through proper synthesis, placement, and routing optimizations.

- Security: Implement security features, such as encryption and authentication, to protect intellectual property and sensitive data stored or processed by the FPGA.

- Compliance: Ensure the design complies with relevant industry standards and regulations, such as FCC for electromagnetic compatibility (EMC) and safety certifications.

- Future Scalability: Design the system with scalability in mind, allowing for future upgrades or expansions without significant redesign efforts.

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6. What is the process for return or replacement of 10AX057K3F40E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX057K3F40E2SG we delivered, we will accept the replacement or return of the 10AX057K3F40E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057K3F40E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations