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Name: 10AX057K2F35I1SG
Brand: Intel
SKU: 10AX057K2F35I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057K2F35I1SG

Part No.:: 10AX057K2F35I1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX057K2F35I1SG.pdf

Description:: IC FPGA 492 I/O 1152FCBGA

In Stock:: 3540

Quantity:: Add To Cart

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10AX057K2F35I1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
492
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX057K2F35I1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057K2F35I1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057K2F35I1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057K2F35I1SG information

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10AX057K2F35I1SG Application Introduction

10AX057K2F35I1SG is a field-programmable gate array (FPGA) chip known for its high performance and versatility, commonly utilized in a variety of digital design projects.

Application Scenario:

In digital signal processing applications, 10AX057K2F35I1SG can be employed to implement complex algorithms for tasks such as image processing or audio signal processing.

Circuit Design:

To effectively utilize 10AX057K2F35I1SG in a design project, consider the following steps:

1. Power Management:

Implement robust power supply circuitry to ensure stable voltage levels are supplied to the 10AX057K2F35I1SG chip and its associated components. Utilize voltage regulators and decoupling capacitors to minimize noise and ensure reliable operation.

2. Signal Integrity:

Pay attention to signal integrity by carefully routing high-speed signals on the PCB layout. Use impedance matching techniques and minimize signal reflections to maintain signal integrity and prevent data corruption.

3. Thermal Management:

Implement effective thermal management techniques to dissipate heat generated by the 10AX057K2F35I1SG chip during operation. Utilize heat sinks, thermal vias, and proper airflow design to prevent overheating and ensure long-term reliability.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate timing for the 10AX057K2F35I1SG chip and synchronized operation of its internal components. Use dedicated clock lines and minimize clock skew to maintain system performance.

5. I/O Planning:

Optimize the placement and routing of input/output (I/O) signals to minimize signal delays and ensure efficient data transfer. Consider the I/O requirements of the design and allocate appropriate resources on the 10AX057K2F35I1SG chip for interfacing with external devices.

Considerations:

When designing with 10AX057K2F35I1SG, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources, including logic elements, memory blocks, and DSP slices, to optimize performance and minimize resource wastage.

- Timing Closure: Perform timing analysis and ensure timing constraints are met to prevent timing violations and ensure reliable operation of the design.

- Design Validation: Thoroughly test the design using simulation tools and hardware-in-the-loop (HIL) testing to verify functionality and performance before deployment.

- Design Iteration: Iterate on the design based on feedback and performance evaluations to refine and improve the design for better efficiency and functionality.

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6. What is the process for return or replacement of 10AX057K2F35I1SG?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057K2F35I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations