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Name: 10AX057K2F35E2LG
Brand: Intel
SKU: 10AX057K2F35E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057K2F35E2LG

Part No.:: 10AX057K2F35E2LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX057K2F35E2LG.pdf

Description:: IC FPGA 396 I/O 1152FBGA

In Stock:: 2699

Quantity:: Add To Cart

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10AX057K2F35E2LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX057K2F35E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057K2F35E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057K2F35E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057K2F35E2LG information

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10AX057K2F35E2LG Application Introduction

10AX057K2F35E2LG is a Field-Programmable Gate Array (FPGA) device known for its versatility and high-performance capabilities, commonly used in various digital design projects for applications ranging from telecommunications to industrial automation.

Application Scenario:

In a digital signal processing project, 10AX057K2F35E2LG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX057K2F35E2LG in a digital design project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization of 10AX057K2F35E2LG and associated peripherals. Utilize low-dropout voltage regulators and power gating techniques to minimize power consumption during idle or standby modes.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and maintain signal integrity. Pay attention to signal routing techniques, such as impedance matching and signal termination, to mitigate signal degradation and ensure reliable data transmission within the FPGA system.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of 10AX057K2F35E2LG during operation. Incorporate proper heat sinks, thermal vias, and airflow considerations in the PCB design to dissipate heat efficiently and maintain optimal operating temperatures.

4. Clock Distribution:

Optimize clock distribution within the FPGA system to minimize clock skew and jitter. Implement clock tree synthesis techniques and utilize dedicated clock routing resources within 10AX057K2F35E2LG to ensure synchronous operation of all components within the system.

5. Resource Utilization:

Maximize resource utilization within 10AX057K2F35E2LG by efficiently partitioning and mapping the design onto FPGA fabric. Utilize advanced synthesis and optimization tools to minimize logic duplication, optimize routing congestion, and maximize performance while meeting timing constraints.

Considerations:

When designing with 10AX057K2F35E2LG, it's essential to consider:

- Design Constraints: Understand the limitations and constraints of the FPGA device, such as logic cell count, available memory resources, and I/O capabilities, to optimize the design accordingly.

- Design Validation: Perform thorough functional verification and timing analysis to ensure the design meets performance requirements and operates reliably under various operating conditions.

- Design Reusability: Modularize the design and utilize IP cores and reusable components to facilitate design reuse and accelerate development cycles for future projects.

- Security Considerations: Implement security measures, such as bitstream encryption and secure boot mechanisms, to protect intellectual property and prevent unauthorized access to the FPGA design.

- Design Documentation: Maintain comprehensive documentation of the FPGA design, including design specifications, test plans, and implementation details, to facilitate collaboration and future maintenance.

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6. What is the process for return or replacement of 10AX057K2F35E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX057K2F35E2LG we delivered, we will accept the replacement or return of the 10AX057K2F35E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057K2F35E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations