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Name: 10AX057H4F34E3LG
Brand: Intel
SKU: 10AX057H4F34E3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX057H4F34E3LG

Part No.:: 10AX057H4F34E3LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX057H4F34E3LG.pdf

Description:: IC FPGA 492 I/O 1152FBGA

In Stock:: 3992

Quantity:: Add To Cart

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10AX057H4F34E3LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
217080
NumberofLogicElements/Cells:
570000
TotalRAMBits:
42082304
NumberofI/O:
492
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX057H4F34E3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX057H4F34E3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX057H4F34E3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX057H4F34E3LG information

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10AX057H4F34E3LG Application Introduction

10AX057H4F34E3LG is a field-programmable gate array (FPGA) chip known for its high performance and versatility in various electronic applications. It offers reconfigurable logic resources, embedded memory blocks, and high-speed I/O interfaces, making it suitable for a wide range of design projects.

Application Scenario:

In the design of digital signal processing (DSP) systems, 10AX057H4F34E3LG can be utilized to implement complex algorithms for audio and image processing, communications, and control applications.

Circuit Design:

To effectively utilize 10AX057H4F34E3LG in your project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels throughout the FPGA and associated components. Use low-dropout regulators (LDOs) and bypass capacitors to minimize voltage fluctuations and noise.

2. Signal Integrity:

Optimize signal integrity by carefully designing the PCB layout to minimize signal reflections, crosstalk, and impedance mismatches. Pay attention to high-speed signal routing, impedance matching, and proper grounding techniques.

3. Thermal Management:

Manage heat dissipation effectively to prevent thermal issues and ensure reliable operation of 10AX057H4F34E3LG. Utilize thermal vias, heat sinks, and proper airflow within the enclosure to dissipate heat generated during operation.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and synchronized clock signals throughout the FPGA design. Use dedicated clock lines, clock buffers, and proper termination techniques to minimize clock skew and jitter.

5. Design for Testability:

Include built-in self-test (BIST) circuitry and debug features in the FPGA design to facilitate testing and debugging during development and production. Incorporate boundary scan (JTAG) capabilities for efficient board-level testing.

Considerations:

When optimizing the design with 10AX057H4F34E3LG, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize FPGA resources to minimize area utilization and maximize performance.

- Timing Constraints: Meet timing constraints by carefully analyzing critical paths and optimizing the design for maximum clock frequency.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property (IP) embedded in the FPGA design.

- Compliance Standards: Ensure compliance with industry standards and regulations, such as FCC electromagnetic compatibility (EMC) and European Union Restriction of Hazardous Substances (RoHS) directives.

- Future Expansion: Design the system with scalability in mind to accommodate future upgrades and enhancements, such as additional functionality or increased processing power.

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6. What is the process for return or replacement of 10AX057H4F34E3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX057H4F34E3LG we delivered, we will accept the replacement or return of the 10AX057H4F34E3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX057H4F34E3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations