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Name: 10AX048K3F35I2LG
Brand: Intel
SKU: 10AX048K3F35I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX048K3F35I2LG

Part No.:: 10AX048K3F35I2LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX048K3F35I2LG.pdf

Description:: IC FPGA 396 I/O 1152FBGA

In Stock:: 2592

Quantity:: Add To Cart

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10AX048K3F35I2LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
183590
NumberofLogicElements/Cells:
480000
TotalRAMBits:
5664768
NumberofI/O:
396
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX048K3F35I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX048K3F35I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX048K3F35I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX048K3F35I2LG information

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10AX048K3F35I2LG Application Introduction

10AX048K3F35I2LG is a field-programmable gate array (FPGA) with advanced features, commonly utilized in high-performance computing and digital signal processing applications. It offers a large number of configurable logic blocks, embedded memory, and high-speed I/O interfaces.

Application Scenario:

In image processing applications, 10AX048K3F35I2LG can be employed to implement complex algorithms for real-time image enhancement or pattern recognition in medical imaging devices.

Design Optimization:

To effectively utilize 10AX048K3F35I2LG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX048K3F35I2LG and associated components. Utilize low-power modes and dynamic voltage scaling where applicable to optimize power usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure high signal integrity. Pay attention to signal routing, impedance matching, and ground plane design to mitigate signal reflections and crosstalk.

3. Thermal Management:

Ensure effective thermal management to prevent overheating of 10AX048K3F35I2LG and maintain reliable operation. Use proper heat sinks, thermal vias, and airflow design to dissipate heat efficiently and maintain the FPGA within safe operating temperatures.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring reliable timing performance of 10AX048K3F35I2LG and synchronous circuits. Use PLLs and clock buffers to generate and distribute clock signals with low skew and jitter.

5. Design Partitioning:

Break down the design into smaller modules or tasks and optimize each module separately to improve overall performance and resource utilization. Utilize the hierarchical design approach to facilitate easier debugging and verification of the design.

Considerations:

When optimizing the design, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize the available logic resources, memory blocks, and I/O interfaces of 10AX048K3F35I2LG to minimize resource wastage and maximize design efficiency.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met, and the design operates reliably at the desired clock frequencies.

- Design Constraints: Consider design constraints such as maximum operating frequency, area constraints, and timing requirements to guide the optimization process and ensure design feasibility.

- Test and Verification: Implement comprehensive testing and verification strategies to validate the functionality, performance, and reliability of the optimized design under various operating conditions.

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3. Are the 10AX048K3F35I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX048K3F35I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX048K3F35I2LG we delivered, we will accept the replacement or return of the 10AX048K3F35I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX048K3F35I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations