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Name: 10AX048H4F34E3SG
Brand: Intel
SKU: 10AX048H4F34E3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX048H4F34E3SG

Part No.:: 10AX048H4F34E3SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX048H4F34E3SG.pdf

Description:: IC FPGA 492 I/O 1152FBGA

In Stock:: 2657

Quantity:: Add To Cart

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10AX048H4F34E3SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
183590
NumberofLogicElements/Cells:
480000
TotalRAMBits:
5664768
NumberofI/O:
492
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX048H4F34E3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX048H4F34E3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX048H4F34E3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX048H4F34E3SG information

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10AX048H4F34E3SG Application Introduction

10AX048H4F34E3SG is a field-programmable gate array (FPGA) known for its high performance and versatility in a wide range of applications, from telecommunications to automotive systems.

Application Scenario:

In telecommunications infrastructure, 10AX048H4F34E3SG can be utilized for signal processing tasks, such as baseband processing in wireless communication systems.

Circuit Design:

To effectively incorporate 10AX048H4F34E3SG into your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization of 10AX048H4F34E3SG and associated peripherals. Utilize low-power modes when the device is idle and employ dynamic voltage and frequency scaling to adapt power consumption to workload demands.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure proper signal integrity. Use impedance matching techniques, differential signaling, and signal termination to maintain signal quality and reduce electromagnetic interference (EMI).

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX048H4F34E3SG to prevent overheating and maintain reliable operation. Use proper heat sinks, thermal vias, and airflow optimization techniques to dissipate heat effectively.

4. Clock Distribution:

Optimize clock distribution to ensure synchronous operation and minimize clock skew. Use low-jitter clock sources, proper clock tree synthesis, and clock buffering techniques to maintain timing integrity and maximize system performance.

5. Design for Testability (DFT):

Incorporate built-in self-test (BIST) and boundary scan features to facilitate testing and debugging of 10AX048H4F34E3SG-based systems. Implement comprehensive test strategies to verify functionality and identify potential defects during development and production stages.

Considerations:

When designing with 10AX048H4F34E3SG, it's essential to consider:

- Resource Utilization: Optimize resource allocation and utilization to maximize FPGA performance and minimize resource contention.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met and critical paths are optimized for maximum operating frequency.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect intellectual property (IP) and prevent unauthorized access to the FPGA configuration.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to your application, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards for automotive electronics.

- Lifecycle Management: Plan for long-term availability and support of 10AX048H4F34E3SG to mitigate risks associated with component obsolescence and ensure continuity of production and maintenance.

10AX048H4F34E3SG FAQ

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3. Are the 10AX048H4F34E3SG price and inventory displayed accurate?

The price and inventory of 10AX048H4F34E3SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX048H4F34E3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX048H4F34E3SG we delivered, we will accept the replacement or return of the 10AX048H4F34E3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX048H4F34E3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations