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Name: 10AX032H2F35I2SG
Brand: Intel
SKU: 10AX032H2F35I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H2F35I2SG

Part No.:: 10AX032H2F35I2SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H2F35I2SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3301

Quantity:: Add To Cart

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10AX032H2F35I2SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032H2F35I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H2F35I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H2F35I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H2F35I2SG information

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10AX032H2F35I2SG Application Introduction

10AX032H2F35I2SG is a field-programmable gate array (FPGA) device known for its high performance and versatility, widely used in various electronic design projects.

Application Scenario:

In a digital signal processing application, 10AX032H2F35I2SG can be utilized to implement complex algorithms for audio or video processing tasks in real-time.

Circuit Design:

To effectively integrate 10AX032H2F35I2SG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of 10AX032H2F35I2SG and associated circuitry. Utilize low-dropout voltage regulators and power gating techniques to achieve power savings during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as crosstalk, reflections, and signal distortion. Use proper ground and power plane separation, impedance matching techniques, and controlled impedance traces for high-speed interfaces to maintain signal integrity and minimize noise.

3. Thermal Management:

Implement effective thermal management strategies to dissipate heat generated by 10AX032H2F35I2SG and prevent overheating. Utilize heat sinks, thermal vias, and proper airflow design to ensure reliable operation under high temperature conditions.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and accurate clock signals are provided to 10AX032H2F35I2SG and other clock-dependent components. Use low-skew clock distribution techniques, such as clock buffers and phase-locked loops (PLLs), to minimize clock jitter and skew.

5. Design for Testability:

Implement built-in self-test (BIST) features and boundary scan testing techniques to facilitate testing and debugging of 10AX032H2F35I2SG during development and production phases. Utilize on-chip resources, such as embedded logic analyzers and debug interfaces, for efficient debugging and verification.

Considerations:

When designing with 10AX032H2F35I2SG, keep in mind:

- Resource Utilization: Optimize resource utilization by effectively mapping the design onto the FPGA fabric and minimizing resource wastage.

- Timing Constraints: Meet timing constraints by carefully analyzing timing paths and optimizing critical paths to ensure reliable operation at the desired clock frequency.

- Security: Implement security features such as bitstream encryption and secure boot mechanisms to protect the intellectual property (IP) and ensure secure operation of the FPGA-based system.

- Design Validation: Perform thorough functional and performance testing to validate the design functionality and ensure it meets the project requirements and specifications.

- Design Iteration: Iterate the design process to refine and optimize the implementation based on performance feedback and validation results, ensuring continuous improvement and optimization of the design.

10AX032H2F35I2SG FAQ

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3. Are the 10AX032H2F35I2SG price and inventory displayed accurate?

The price and inventory of 10AX032H2F35I2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX032H2F35I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H2F35I2SG we delivered, we will accept the replacement or return of the 10AX032H2F35I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H2F35I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations