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Name: 10AX032H2F35I1SG
Brand: Intel
SKU: 10AX032H2F35I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H2F35I1SG

Part No.:: 10AX032H2F35I1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H2F35I1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 2424

Quantity:: Add To Cart

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10AX032H2F35I1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032H2F35I1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H2F35I1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H2F35I1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H2F35I1SG information

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10AX032H2F35I1SG Application Introduction

10AX032H2F35I1SG is a Field-Programmable Gate Array (FPGA) device offering high-performance and flexibility, widely used in diverse electronic design projects for its configurable logic and processing capabilities.

Application Scenario:

In digital signal processing applications, 10AX032H2F35I1SG can be utilized to implement complex algorithms for tasks such as image processing or audio signal modulation.

Circuit Design:

To effectively utilize 10AX032H2F35I1SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable voltage and current levels for 10AX032H2F35I1SG operation. Utilize low-dropout regulators and decoupling capacitors to minimize voltage fluctuations and noise.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and interference. Use impedance matching techniques for high-speed signal traces connected to 10AX032H2F35I1SG to maintain signal integrity and reduce reflections.

3. Thermal Management:

Ensure proper heat dissipation for 10AX032H2F35I1SG to prevent overheating and maintain optimal performance. Incorporate heat sinks, thermal vias, and adequate ventilation in the PCB layout to dissipate heat effectively.

4. Clock Distribution:

Implement a robust clock distribution network to provide synchronized clock signals to 10AX032H2F35I1SG and other components in the system. Use low-skew clock routing techniques to minimize clock skew and ensure accurate timing.

5. Configuration Management:

Optimize the configuration process of 10AX032H2F35I1SG by utilizing efficient programming methods, such as partial reconfiguration or remote configuration. Implement error checking mechanisms to ensure reliable configuration updates.

Considerations:

When designing with 10AX032H2F35I1SG, it's essential to consider:

- Resource Utilization: Efficiently utilize the FPGA resources to minimize resource wastage and maximize design flexibility.

- Timing Constraints: Analyze timing constraints carefully and optimize the design to meet timing requirements for reliable operation.

- Debugging and Testing: Incorporate debug features and test points in the design to facilitate debugging and validation of the FPGA implementation.

- Security: Implement security measures, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Future Scalability: Design the system with scalability in mind to accommodate future enhancements or upgrades without significant redesign effort.

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3. Are the 10AX032H2F35I1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032H2F35I1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H2F35I1SG we delivered, we will accept the replacement or return of the 10AX032H2F35I1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H2F35I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations