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Name: 10AX032H2F35I1HG
Brand: Intel
SKU: 10AX032H2F35I1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H2F35I1HG

Part No.:: 10AX032H2F35I1HG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H2F35I1HG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3488

Quantity:: Add To Cart

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10AX032H2F35I1HG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032H2F35I1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H2F35I1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H2F35I1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H2F35I1HG information

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10AX032H2F35I1HG Application Introduction

10AX032H2F35I1HG is a Field-Programmable Gate Array (FPGA) chip known for its high performance and versatility in various digital design projects. It offers a wide range of features, including programmable logic blocks, embedded memory, and high-speed transceivers, making it suitable for applications requiring flexible and customizable digital processing capabilities.

Application Scenario:

In digital signal processing (DSP) applications, 10AX032H2F35I1HG can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, or communications processing in real-time systems.

Circuit Design:

To effectively utilize 10AX032H2F35I1HG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation. Utilize power gating, dynamic voltage and frequency scaling (DVFS), and low-power modes available in 10AX032H2F35I1HG to optimize power usage based on the application's requirements.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and other sources of noise that can affect signal integrity. Pay special attention to high-speed interfaces and routing guidelines provided in the 10AX032H2F35I1HG datasheet to maintain signal integrity and ensure reliable data transmission.

3. Thermal Management:

Ensure proper thermal dissipation for 10AX032H2F35I1HG to prevent overheating and ensure long-term reliability. Use thermal vias, heatsinks, or fans to dissipate heat effectively, especially in designs with high computational loads or operating in harsh environments.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and jitter-free clock signals to 10AX032H2F35I1HG. Use clock buffers, PLLs, and clock routing guidelines recommended by the FPGA manufacturer to minimize clock skew and ensure synchronous operation of all components in the system.

5. I/O Planning:

Optimize I/O placement and routing to minimize signal delay and improve signal integrity. Group related I/O pins together and follow recommended I/O placement guidelines provided in the 10AX032H2F35I1HG datasheet to reduce routing congestion and simplify PCB layout.

Considerations:

When designing with 10AX032H2F35I1HG, keep the following considerations in mind:

- Timing Closure: Ensure that the design meets timing constraints specified by the FPGA tools to guarantee proper functionality and performance.

- Resource Utilization: Optimize resource utilization to maximize FPGA efficiency and minimize resource conflicts.

- Design Validation: Thoroughly test the design using simulation, emulation, and hardware testing to verify functionality, performance, and reliability before deployment.

- Documentation: Maintain comprehensive documentation of the design, including schematics, PCB layouts, and design constraints, to facilitate future debugging, modification, and maintenance.

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3. Are the 10AX032H2F35I1HG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032H2F35I1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H2F35I1HG we delivered, we will accept the replacement or return of the 10AX032H2F35I1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H2F35I1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations