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Name: 10AX032H2F35E1SG
Brand: Intel
SKU: 10AX032H2F35E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H2F35E1SG

Part No.:: 10AX032H2F35E1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H2F35E1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 2240

Quantity:: Add To Cart

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10AX032H2F35E1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032H2F35E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H2F35E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H2F35E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H2F35E1SG information

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10AX032H2F35E1SG Application Introduction

10AX032H2F35E1SG is a field-programmable gate array (FPGA) manufactured by Intel, offering high performance and flexibility for a wide range of applications, including embedded systems, data processing, and telecommunications.

Application Scope:

In digital signal processing (DSP) applications, 10AX032H2F35E1SG can be utilized to implement complex algorithms for audio and video processing, communication protocols, and image recognition.

Design Strategies:

To maximize the effectiveness of 10AX032H2F35E1SG in your project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX032H2F35E1SG and associated peripherals. Utilize low-power modes and dynamic voltage scaling to optimize power usage.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing PCB layout, minimizing signal traces' length, and using impedance-matched transmission lines. Implement termination techniques, such as series resistors or termination resistors, to reduce signal reflections and maintain signal integrity.

3. Thermal Management:

Prevent overheating of 10AX032H2F35E1SG by incorporating adequate thermal management techniques. Use heat sinks, thermal vias, and thermal pads to dissipate heat efficiently. Ensure proper airflow and ventilation in the system enclosure to maintain the FPGA's temperature within the operating limits.

4. Clocking Architecture:

Design a robust clocking architecture to generate stable clock signals for 10AX032H2F35E1SG and synchronize timing across different FPGA modules. Use clock distribution networks, phase-locked loops (PLLs), and clock skew minimization techniques to achieve precise timing control and minimize clock jitter.

5. Design Partitioning:

Partition the FPGA design into smaller, manageable modules to facilitate design verification, testing, and debugging. Use hierarchical design methodologies and IP core integration to improve design modularity and reuse. Optimize resource utilization by analyzing and optimizing the placement and routing of FPGA logic elements.

Considerations:

When designing with 10AX032H2F35E1SG, consider the following factors:

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize costs.

- Timing Closure: Perform timing analysis and closure to ensure that the design meets timing requirements and operates reliably at the target clock frequency.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering with the FPGA configuration.

- System Integration: Integrate the FPGA seamlessly into the overall system architecture, considering compatibility with other components, interfaces, and communication protocols.

- Design Verification: Thoroughly verify the FPGA design using simulation, emulation, and prototyping techniques to ensure functional correctness and performance compliance with the project requirements.

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3. Are the 10AX032H2F35E1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032H2F35E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H2F35E1SG we delivered, we will accept the replacement or return of the 10AX032H2F35E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H2F35E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations