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Name: 10AX032H2F34E1SG
Brand: Intel
SKU: 10AX032H2F34E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H2F34E1SG

Part No.:: 10AX032H2F34E1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H2F34E1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3241

Quantity:: Add To Cart

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10AX032H2F34E1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032H2F34E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H2F34E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H2F34E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H2F34E1SG information

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10AX032H2F34E1SG Application Introduction

10AX032H2F34E1SG is a Field-Programmable Gate Array (FPGA) device known for its versatility and performance, commonly used in a variety of electronic design projects for its reconfigurable nature and high-speed processing capabilities.

Application Scenario:

In a digital signal processing application, 10AX032H2F34E1SG can be utilized to implement complex algorithms for audio or image processing tasks, such as noise reduction or image recognition.

Circuit Design:

To effectively integrate 10AX032H2F34E1SG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels across the FPGA and associated components. Utilize voltage regulators and bypass capacitors strategically to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay careful attention to signal integrity during PCB layout and routing. Use controlled impedance traces for high-speed signals connected to 10AX032H2F34E1SG to minimize signal distortion and ensure reliable data transmission.

3. Thermal Management:

Deploy effective thermal management solutions to dissipate heat generated by the FPGA and prevent overheating. Incorporate heat sinks, thermal vias, and proper airflow within the enclosure to maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise timing synchronization across the FPGA and peripheral devices. Utilize clock buffers, PLLs, and clock routing techniques to minimize clock skew and jitter.

5. I/O Planning:

Optimize I/O planning to maximize the utilization of available I/O resources on 10AX032H2F34E1SG. Group related I/O signals, utilize differential signaling where necessary, and employ proper termination techniques to enhance signal integrity and noise immunity.

Considerations:

When designing with 10AX032H2F34E1SG, keep in mind the following considerations:

- Resource Utilization: Efficiently utilize the FPGA resources, including logic cells, memory blocks, and DSP slices, to optimize performance and minimize resource wastage.

- Design Iteration: Embrace a iterative design approach, leveraging simulation tools and prototyping platforms to refine and optimize the FPGA implementation before final deployment.

- Functional Safety: Ensure compliance with relevant functional safety standards, especially in safety-critical applications, by implementing appropriate fault-tolerant mechanisms and diagnostic features.

- Firmware Development: Develop well-structured and optimized firmware code to efficiently utilize the FPGA resources and maximize performance while minimizing power consumption.

- System Integration: Collaborate closely with other subsystems and stakeholders to seamlessly integrate the FPGA-based solution into the overall system architecture, ensuring compatibility and interoperability.

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3. Are the 10AX032H2F34E1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032H2F34E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H2F34E1SG we delivered, we will accept the replacement or return of the 10AX032H2F34E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H2F34E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations