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Name: 10AX032H1F34I1SG
Brand: Intel
SKU: 10AX032H1F34I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H1F34I1SG

Part No.:: 10AX032H1F34I1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H1F34I1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3143

Quantity:: Add To Cart

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10AX032H1F34I1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032H1F34I1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H1F34I1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H1F34I1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H1F34I1SG information

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10AX032H1F34I1SG Application Introduction

10AX032H1F34I1SG is a field-programmable gate array (FPGA) with advanced features, widely used in digital design projects for its flexibility and performance.

Application Scenario:

In digital signal processing applications, 10AX032H1F34I1SG can be utilized to implement complex algorithms such as image processing or audio filtering.

Circuit Design:

To effectively use 10AX032H1F34I1SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 10AX032H1F34I1SG and associated components. Utilize power gating techniques and dynamic voltage scaling to optimize power usage during different operating modes.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion and crosstalk. Pay special attention to high-speed signal traces and use proper termination techniques, such as series termination resistors, to maintain signal integrity and reduce reflections.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX032H1F34I1SG to prevent overheating and ensure reliable operation. Use thermal vias and heat sinks to dissipate heat efficiently, and consider ambient temperature and airflow when designing the enclosure.

4. Clock Distribution:

Implement a robust clock distribution network to provide stable clock signals to 10AX032H1F34I1SG and synchronize multiple components within the system. Use clock buffers and fanout strategies to minimize skew and jitter in the clock signals.

5. Design Partitioning:

Partition the design into smaller, manageable blocks to facilitate easier implementation and debugging. Utilize hierarchical design methodologies and IP cores to encapsulate reusable modules and simplify the overall design process.

Considerations:

When optimizing the design with 10AX032H1F34I1SG, keep in mind:

- Resource Utilization: Optimize resource usage to maximize the efficiency of 10AX032H1F34I1SG and minimize area overhead.

- Timing Constraints: Meet timing constraints to ensure proper functionality and performance of the design. Use timing analysis tools to identify critical paths and optimize timing closure.

- Design Reusability: Design with modularity and reusability in mind to facilitate future revisions and iterations of the project. Use parameterized modules and design patterns to create flexible and scalable designs.

- Verification and Testing: Perform thorough verification and testing at each stage of the design process to identify and resolve potential issues early. Utilize simulation tools and hardware-in-the-loop testing to validate the functionality and performance of the design.

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3. Are the 10AX032H1F34I1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032H1F34I1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H1F34I1SG we delivered, we will accept the replacement or return of the 10AX032H1F34I1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H1F34I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations