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Name: 10AX032H1F34E1SG
Brand: Intel
SKU: 10AX032H1F34E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H1F34E1SG

Part No.:: 10AX032H1F34E1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H1F34E1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 2596

Quantity:: Add To Cart

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10AX032H1F34E1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032H1F34E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H1F34E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H1F34E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H1F34E1SG information

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10AX032H1F34E1SG Application Introduction

10AX032H1F34E1SG is a field-programmable gate array (FPGA) known for its versatility and high-performance capabilities, widely used in various electronic design projects.

Application Scenario:

In digital signal processing applications, 10AX032H1F34E1SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively use 10AX032H1F34E1SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure the 10AX032H1F34E1SG operates within its specified power requirements. Utilize low-dropout voltage regulators and proper decoupling capacitors to minimize power noise and ensure stable operation.

2. Signal Integrity:

Pay attention to signal integrity to prevent signal degradation or distortion. Properly terminate high-speed signal lines and use impedance-matched traces to maintain signal integrity throughout the design.

3. Thermal Management:

Ensure adequate thermal management to prevent overheating of the 10AX032H1F34E1SG device. Utilize thermal vias and heat sinks to dissipate heat efficiently, especially in designs with high computational loads or operating in harsh environmental conditions.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter. Use dedicated clock networks and buffer circuits to ensure reliable and synchronous operation of the 10AX032H1F34E1SG across the entire design.

5. I/O Planning:

Carefully plan the input/output (I/O) configuration to maximize the utilization of available I/O resources on the 10AX032H1F34E1SG. Assign critical signals to dedicated I/O banks and implement proper I/O voltage level shifting if interfacing with external components operating at different voltage levels.

Considerations:

When designing with 10AX032H1F34E1SG, keep the following considerations in mind:

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize resource conflicts.

- Design Constraints: Adhere to design constraints, such as timing, area, and power, to ensure the design meets performance requirements and operates reliably.

- Design Validation: Thoroughly validate the design through simulation and testing to identify and address any potential issues or bottlenecks early in the development process.

- Firmware Optimization: Write efficient firmware code to minimize resource utilization and maximize performance, especially in designs with limited FPGA resources.

- Design Scalability: Design the system with scalability in mind to accommodate future enhancements or upgrades without significant redesign efforts.

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6. What is the process for return or replacement of 10AX032H1F34E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H1F34E1SG we delivered, we will accept the replacement or return of the 10AX032H1F34E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H1F34E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations