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Name: 10AX032H1F34E1HG
Brand: Intel
SKU: 10AX032H1F34E1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032H1F34E1HG

Part No.:: 10AX032H1F34E1HG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX032H1F34E1HG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 2285

Quantity:: Add To Cart

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10AX032H1F34E1HG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032H1F34E1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032H1F34E1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032H1F34E1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032H1F34E1HG information

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10AX032H1F34E1HG Application Introduction

10AX032H1F34E1HG is a versatile FPGA chip offering high-performance computing capabilities and extensive I/O interfaces, commonly used in various electronic design projects.

Application Scenario:

In digital signal processing applications, 10AX032H1F34E1HG can be utilized to implement complex algorithms for tasks such as image processing or audio signal analysis.

Circuit Design:

To effectively utilize 10AX032H1F34E1HG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure stable voltage levels for 10AX032H1F34E1HG and associated peripherals. Utilize voltage regulators and power planes to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as reflections, crosstalk, and signal distortion. Use impedance-matched traces and proper termination techniques to maintain signal integrity.

3. Thermal Management:

Optimize thermal dissipation by incorporating heat sinks, thermal vias, and proper airflow in the system design. Ensure that the operating temperature of 10AX032H1F34E1HG stays within the specified limits to prevent performance degradation or failure.

4. Clock Distribution:

Design a robust clock distribution network to ensure precise clocking for 10AX032H1F34E1HG and synchronous circuits. Use low-skew clock distribution techniques and clock buffering to minimize clock skew and jitter.

5. Design for Testability:

Include built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of the FPGA design. Implement boundary scan testing and on-chip diagnostic capabilities for efficient fault detection and diagnosis.

Considerations:

When designing with 10AX032H1F34E1HG, keep in mind the following considerations:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize resource conflicts.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met and the design operates at the desired clock frequency.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the FPGA configuration from unauthorized access or tampering.

- System Integration: Interface 10AX032H1F34E1HG with other system components using appropriate communication protocols and interface standards. Ensure compatibility and interoperability with external devices and systems.

- Compliance and Standards: Design the system to comply with relevant industry standards and regulations, such as FCC emissions regulations or safety standards for electronic equipment.

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6. What is the process for return or replacement of 10AX032H1F34E1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032H1F34E1HG we delivered, we will accept the replacement or return of the 10AX032H1F34E1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032H1F34E1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations