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Name: 10AX032E4F27E3SG
Brand: Intel
SKU: 10AX032E4F27E3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E4F27E3SG

Part No.:: 10AX032E4F27E3SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX032E4F27E3SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3043

Quantity:: Add To Cart

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10AX032E4F27E3SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032E4F27E3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E4F27E3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E4F27E3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E4F27E3SG information

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10AX032E4F27E3SG Application Introduction

10AX032E4F27E3SG is a field-programmable gate array (FPGA) device manufactured by Intel, offering high-performance and flexibility for various digital design applications.

Application Scenario:

In digital signal processing (DSP) applications, 10AX032E4F27E3SG can be utilized to implement complex algorithms for audio processing, image recognition, and communication systems.

Circuit Design:

To effectively utilize 10AX032E4F27E3SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption of 10AX032E4F27E3SG. Utilize low-dropout voltage regulators and power gating techniques to optimize power usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and noise interference. Ensure proper termination techniques, such as series termination resistors, and use impedance-matched traces for critical high-speed interfaces of 10AX032E4F27E3SG.

3. Thermal Management:

Ensure effective thermal dissipation for 10AX032E4F27E3SG to prevent overheating and maintain reliable operation. Utilize heat sinks, thermal vias, and proper airflow within the system enclosure to dissipate heat generated during operation.

4. Clock Distribution:

Implement a robust clock distribution network to ensure synchronous operation and timing accuracy of 10AX032E4F27E3SG. Use clock buffers, phase-locked loops (PLLs), and proper clock routing techniques to distribute clock signals efficiently.

5. Design for Testability:

Incorporate built-in self-test (BIST) features and test access mechanisms into the design of 10AX032E4F27E3SG to facilitate manufacturing testing and debugging processes. Ensure easy access to test points and debug interfaces for efficient validation and verification.

Considerations:

When optimizing the design with 10AX032E4F27E3SG, it's important to consider:

- Resource Utilization: Optimize FPGA resource utilization by implementing efficient logic synthesis and placement strategies to maximize performance and minimize resource conflicts.

- Design Constraints: Adhere to timing constraints, such as setup and hold times, to ensure proper operation of the design within specified timing requirements.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Functional Safety: Design the system to meet functional safety requirements, such as ISO 26262 for automotive applications, by implementing error detection and mitigation mechanisms within 10AX032E4F27E3SG.

- Environmental Considerations: Ensure that the design complies with environmental regulations, such as RoHS directives, by selecting components and materials that are compliant with relevant standards.

10AX032E4F27E3SG FAQ

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3. Are the 10AX032E4F27E3SG price and inventory displayed accurate?

The price and inventory of 10AX032E4F27E3SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX032E4F27E3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E4F27E3SG we delivered, we will accept the replacement or return of the 10AX032E4F27E3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E4F27E3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations