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Name: 10AX032E3F27E2SG
Brand: Intel
SKU: 10AX032E3F27E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E3F27E2SG

Part No.:: 10AX032E3F27E2SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX032E3F27E2SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2420

Quantity:: Add To Cart

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10AX032E3F27E2SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032E3F27E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E3F27E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E3F27E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E3F27E2SG information

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10AX032E3F27E2SG Application Introduction

10AX032E3F27E2SG is a Field-Programmable Gate Array (FPGA) device manufactured by Intel, offering high performance and flexibility for various digital design applications.

Application Scenario:

In digital signal processing (DSP) applications, 10AX032E3F27E2SG can be utilized to implement complex algorithms for audio processing or image/video processing tasks.

Circuit Design:

To maximize the utilization of 10AX032E3F27E2SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization of 10AX032E3F27E2SG and associated peripherals. Utilize low-power modes and dynamic voltage scaling to minimize power consumption during idle or low-load scenarios.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure reliable signal integrity. Utilize proper signal routing techniques, such as impedance matching and signal termination, to mitigate signal reflections and noise.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating of 10AX032E3F27E2SG and ensure reliable operation under varying temperature conditions. Utilize heat sinks, thermal vias, and proper airflow design to dissipate heat efficiently.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and stable clock signals are provided to 10AX032E3F27E2SG and synchronized with other system components. Utilize clock conditioning circuits, such as PLLs or DLLs, to generate and distribute clock signals with minimal jitter and skew.

5. Configuration Management:

Implement secure and reliable configuration management mechanisms to ensure proper initialization and configuration of 10AX032E3F27E2SG during system startup. Utilize configuration memory devices, such as flash memory or external EEPROM, to store FPGA bitstreams securely.

Considerations:

When optimizing the design with 10AX032E3F27E2SG, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize resource conflicts.

- Timing Closure: Ensure timing closure is achieved by meeting all timing constraints and performing thorough timing analysis during the design phase.

- Design Modularity: Design the system with a modular approach to facilitate scalability, reusability, and easier maintenance.

- Verification and Testing: Conduct comprehensive verification and testing procedures to validate the functionality, performance, and reliability of the design under various operating conditions.

- Documentation: Maintain detailed documentation throughout the design process to aid in troubleshooting, future modifications, and knowledge transfer.

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3. Are the 10AX032E3F27E2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032E3F27E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E3F27E2SG we delivered, we will accept the replacement or return of the 10AX032E3F27E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E3F27E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations