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Name: 10AX032E2F27I2SG
Brand: Intel
SKU: 10AX032E2F27I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E2F27I2SG

Part No.:: 10AX032E2F27I2SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX032E2F27I2SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2577

Quantity:: Add To Cart

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10AX032E2F27I2SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032E2F27I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E2F27I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E2F27I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E2F27I2SG information

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10AX032E2F27I2SG Application Introduction

10AX032E2F27I2SG is a field-programmable gate array (FPGA) known for its high-performance capabilities and flexibility, commonly used in a variety of digital design projects.

Application Scenario:

In digital signal processing applications, 10AX032E2F27I2SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX032E2F27I2SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable voltage levels for 10AX032E2F27I2SG and associated components. Utilize low-dropout voltage regulators and decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay attention to signal integrity issues such as signal propagation delay and noise immunity. Proper PCB layout techniques, including impedance matching and signal routing guidelines, can help mitigate signal integrity challenges and ensure reliable operation.

3. Thermal Management:

Optimize thermal management to prevent overheating and ensure long-term reliability of 10AX032E2F27I2SG. Utilize thermal vias, heat sinks, and proper airflow in the system design to dissipate heat effectively.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX032E2F27I2SG and other clock-dependent modules. Minimize clock skew and jitter by carefully routing clock traces and using clock conditioning circuits if necessary.

5. Configuration Management:

Implement efficient FPGA configuration strategies to streamline the programming process and reduce configuration time. Utilize configuration memory devices with fast access times and consider implementing partial reconfiguration techniques for dynamic system updates.

Considerations:

When designing with 10AX032E2F27I2SG, keep in mind the following considerations:

- Resource Utilization: Optimize FPGA resource utilization by carefully designing logic circuits and utilizing advanced synthesis and optimization tools to maximize performance and minimize resource usage.

- Design Constraints: Adhere to timing constraints and resource limitations specified by the FPGA datasheet and design software. Perform thorough timing analysis and constraint verification to ensure design integrity.

- Testing and Validation: Conduct extensive testing and validation throughout the design process to verify functionality, performance, and compliance with project requirements. Use simulation tools and hardware-in-the-loop testing to identify and resolve issues early.

- Documentation: Maintain comprehensive documentation detailing the design specifications, implementation details, and test results. Document design decisions, constraints, and assumptions to facilitate future maintenance and troubleshooting.

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3. Are the 10AX032E2F27I2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032E2F27I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E2F27I2SG we delivered, we will accept the replacement or return of the 10AX032E2F27I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E2F27I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations