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Name: 10AX032E2F27I1HG
Brand: Intel
SKU: 10AX032E2F27I1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E2F27I1HG

Part No.:: 10AX032E2F27I1HG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX032E2F27I1HG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3332

Quantity:: Add To Cart

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10AX032E2F27I1HG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX032E2F27I1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E2F27I1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E2F27I1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E2F27I1HG information

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10AX032E2F27I1HG Application Introduction

10AX032E2F27I1HG is a field-programmable gate array (FPGA) chip known for its high performance and versatility in various electronic applications, including telecommunications, industrial automation, and automotive systems.

Application Scenario:

In telecommunications, 10AX032E2F27I1HG can be utilized for signal processing tasks such as digital signal modulation/demodulation, error correction, and protocol handling in communication equipment.

Circuit Design:

To design an efficient circuit using 10AX032E2F27I1HG, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX032E2F27I1HG. Utilize low-dropout voltage regulators and power gating techniques to manage power domains effectively.

2. Signal Integrity:

Ensure proper signal integrity by employing techniques such as impedance matching, signal termination, and ground/power plane design. Pay special attention to high-speed interfaces and clock distribution networks to minimize signal distortion and jitter.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 10AX032E2F27I1HG and other components. Utilize heat sinks, thermal vias, and proper PCB layout techniques to maintain optimal operating temperatures and prevent thermal-induced failures.

4. Clock Distribution:

Design a robust clock distribution network to ensure reliable clocking of 10AX032E2F27I1HG and synchronize multiple clock domains within the system. Use low-skew clock distribution techniques and buffer devices to minimize clock skew and ensure synchronous operation.

5. I/O Optimization:

Optimize I/O utilization by carefully planning I/O placement and routing to minimize signal delays and maximize signal integrity. Utilize high-speed transceivers and differential signaling for high-speed interfaces to achieve maximum data transfer rates.

Considerations:

When designing with 10AX032E2F27I1HG, it's essential to consider:

- Design Constraints: Understand and adhere to the device's timing, routing, and resource constraints to ensure successful implementation of the design.

- Design Validation: Perform thorough design validation and testing, including functional simulation, timing analysis, and hardware testing, to verify the functionality and performance of the design under various operating conditions.

- Design Reusability: Design the circuit for scalability and reusability by modularizing components, using standard interfaces, and documenting design decisions and configurations for future reference and reuse.

- Environmental Considerations: Consider environmental factors such as temperature, humidity, and vibration, and design the circuit to withstand harsh operating conditions encountered in industrial and automotive environments.

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3. Are the 10AX032E2F27I1HG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX032E2F27I1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E2F27I1HG we delivered, we will accept the replacement or return of the 10AX032E2F27I1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E2F27I1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations