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Name: 10AX032E2F27E2LG
Brand: Intel
SKU: 10AX032E2F27E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E2F27E2LG

Part No.:: 10AX032E2F27E2LG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX032E2F27E2LG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2987

Quantity:: Add To Cart

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10AX032E2F27E2LG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032E2F27E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E2F27E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E2F27E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E2F27E2LG information

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10AX032E2F27E2LG Application Introduction

10AX032E2F27E2LG is a Field-Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera), offering high-performance logic integration and flexible programmability for a wide range of applications.

Application Scenario:

In digital signal processing applications, 10AX032E2F27E2LG can be utilized to implement complex algorithms for audio and video processing, encryption/decryption, and communication protocols.

Circuit Design:

To effectively utilize 10AX032E2F27E2LG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 10AX032E2F27E2LG and associated components. Utilize low-dropout voltage regulators and power gating techniques to manage power domains effectively.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure reliable signal integrity. Utilize proper impedance matching techniques, controlled impedance traces, and signal termination schemes to mitigate signal reflections and crosstalk.

3. Thermal Management:

Optimize thermal dissipation to prevent overheating of 10AX032E2F27E2LG and maintain optimal operating temperatures. Employ thermal vias, heat sinks, and thermal pads to enhance heat transfer and improve overall thermal performance.

4. Clock Distribution:

Implement a robust clock distribution network to ensure precise and stable clock signals throughout the FPGA design. Utilize clock buffers, PLLs (Phase-Locked Loops), and clock tree synthesis techniques to minimize clock skew and jitter.

5. Design Partitioning:

Break down the design into smaller, manageable modules and utilize hierarchical design techniques to facilitate easier debugging, testing, and maintenance. Utilize the hierarchical resources of 10AX032E2F27E2LG effectively to optimize resource utilization and improve design scalability.

Considerations:

When designing with 10AX032E2F27E2LG, it's essential to consider:

- Resource Utilization: Optimize the utilization of logic resources, memory blocks, and DSP slices to maximize the efficiency of the FPGA design.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that all timing constraints are met and critical paths are properly optimized.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and IP theft.

- Design Validation: Conduct comprehensive functional verification and simulation to ensure the correctness and reliability of the FPGA design before deployment.

- Design for Testability: Incorporate built-in self-test (BIST) and design-for-test (DFT) features to facilitate easier testing and debugging of the FPGA design during development and production.

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6. What is the process for return or replacement of 10AX032E2F27E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E2F27E2LG we delivered, we will accept the replacement or return of the 10AX032E2F27E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E2F27E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations