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Name: 10AX032E1F29E1HG
Brand: Intel
SKU: 10AX032E1F29E1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX032E1F29E1HG

Part No.:: 10AX032E1F29E1HG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX032E1F29E1HG.pdf

Description:: IC FPGA 360 I/O 780FBGA

In Stock:: 2011

Quantity:: Add To Cart

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10AX032E1F29E1HG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
119900
NumberofLogicElements/Cells:
320000
TotalRAMBits:
21040128
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX032E1F29E1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX032E1F29E1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX032E1F29E1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX032E1F29E1HG information

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10AX032E1F29E1HG Application Introduction

10AX032E1F29E1HG is a field-programmable gate array (FPGA) chip known for its versatility and high performance in various electronic applications. It offers a wide range of configurable logic blocks, embedded memory, and flexible I/O options, making it suitable for diverse design requirements.

Application Scenario:

In the field of digital signal processing (DSP), 10AX032E1F29E1HG can be utilized to implement complex algorithms for audio and video processing, communication systems, and image processing applications.

Circuit Design:

To effectively utilize 10AX032E1F29E1HG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption. Utilize low-dropout voltage regulators and power-saving modes available in 10AX032E1F29E1HG to optimize energy usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion, noise, and crosstalk. Follow best practices for high-speed digital design, such as proper trace routing, impedance matching, and ground/power plane distribution, to maintain signal integrity in 10AX032E1F29E1HG-based systems.

3. Thermal Management:

Ensure effective heat dissipation to prevent overheating and ensure reliable operation of 10AX032E1F29E1HG. Use heat sinks, thermal vias, and proper airflow in the system enclosure to manage thermal performance and avoid temperature-induced failures.

4. Design Partitioning:

Break down the design into smaller, manageable modules to optimize resource utilization and facilitate easier debugging and testing. Utilize the hierarchical design approach to efficiently organize and implement complex functionalities in 10AX032E1F29E1HG-based systems.

5. Clock Management:

Implement robust clocking strategies to ensure synchronous operation and minimize timing issues in 10AX032E1F29E1HG designs. Use dedicated clock networks, phase-locked loops (PLLs), and clock distribution techniques to generate stable clock signals and synchronize different components effectively.

Considerations:

When designing with 10AX032E1F29E1HG, keep the following considerations in mind:

- Resource Utilization: Optimize FPGA resource allocation to minimize logic utilization and maximize performance efficiency.

- Design Constraints: Adhere to timing, power, and area constraints specified by the target FPGA device to ensure design compatibility and functionality.

- Testing and Verification: Conduct thorough testing and verification procedures to validate the functionality, performance, and reliability of the 10AX032E1F29E1HG-based design under various operating conditions.

- Design Documentation: Maintain comprehensive documentation detailing the design specifications, constraints, implementation details, and testing results to facilitate future maintenance and troubleshooting efforts.

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3. Are the 10AX032E1F29E1HG price and inventory displayed accurate?

The price and inventory of 10AX032E1F29E1HG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX032E1F29E1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX032E1F29E1HG we delivered, we will accept the replacement or return of the 10AX032E1F29E1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX032E1F29E1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations