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Name: 10AX027H3F35E2SG
Brand: Intel
SKU: 10AX027H3F35E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027H3F35E2SG

Part No.:: 10AX027H3F35E2SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX027H3F35E2SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3936

Quantity:: Add To Cart

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10AX027H3F35E2SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027H3F35E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027H3F35E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027H3F35E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027H3F35E2SG information

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10AX027H3F35E2SG Application Introduction

10AX027H3F35E2SG is a field-programmable gate array (FPGA) known for its high performance and versatility, commonly used in a variety of electronic design projects for its adaptability and configurability.

Application Scenario:

In digital signal processing applications, 10AX027H3F35E2SG can be utilized to implement complex algorithms for audio processing, image recognition, and communication protocols.

Circuit Design:

To effectively utilize 10AX027H3F35E2SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply circuitry to provide stable voltage levels to 10AX027H3F35E2SG and associated components. Use voltage regulators, decoupling capacitors, and power sequencing techniques to minimize noise and ensure reliable operation.

2. Signal Integrity:

Ensure proper signal integrity by carefully routing high-speed signals and minimizing signal reflections, crosstalk, and electromagnetic interference (EMI). Follow best practices for impedance matching, ground plane design, and signal termination.

3. Thermal Management:

Implement effective thermal management techniques to dissipate heat generated by 10AX027H3F35E2SG during operation. Use thermal vias, heat sinks, and fans to maintain optimal operating temperatures and prevent thermal throttling.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX027H3F35E2SG and peripheral components. Use low-skew clock buffers, clock trees, and phase-locked loops (PLLs) for precise timing control.

5. Design Verification:

Thoroughly test and verify the functionality of the design using simulation tools, such as ModelSim or Quartus Prime, and prototype hardware. Conduct functional verification, timing analysis, and power consumption measurements to ensure the design meets performance specifications.

Considerations:

When designing with 10AX027H3F35E2SG, consider the following factors:

- Resource Utilization: Optimize FPGA resource utilization to minimize logic and routing congestion, maximizing design efficiency and performance.

- Configuration Management: Implement secure configuration storage and loading mechanisms to protect intellectual property and ensure secure and reliable FPGA operation.

- Design Iteration: Iterate the design process iteratively, refining the architecture, logic, and constraints to achieve the desired performance, functionality, and resource utilization.

- System Integration: Integrate 10AX027H3F35E2SG seamlessly into the overall system architecture, considering compatibility with other components, interfaces, and communication protocols.

- Compliance and Standards: Ensure the design complies with relevant industry standards and regulations, such as FCC Part 15 for electromagnetic compatibility (EMC) and IEC 62304 for medical device software.

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3. Are the 10AX027H3F35E2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027H3F35E2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027H3F35E2SG we delivered, we will accept the replacement or return of the 10AX027H3F35E2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027H3F35E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations