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Name: 10AX027H3F35E2LG
Brand: Intel
SKU: 10AX027H3F35E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027H3F35E2LG

Part No.:: 10AX027H3F35E2LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX027H3F35E2LG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 2115

Quantity:: Add To Cart

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10AX027H3F35E2LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027H3F35E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027H3F35E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027H3F35E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027H3F35E2LG information

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10AX027H3F35E2LG Application Introduction

10AX027H3F35E2LG is a field-programmable gate array (FPGA) chip renowned for its high performance and versatility, commonly used in a wide range of electronic design projects.

Application Scenario:

In digital signal processing applications, 10AX027H3F35E2LG can be utilized to implement complex algorithms for tasks such as image processing or audio signal analysis.

Circuit Design:

To effectively utilize 10AX027H3F35E2LG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power utilization and prolong the battery life if applicable. Utilize power-saving modes and clock gating techniques to minimize power consumption during idle periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference. Use proper termination techniques, impedance matching, and ground planes to maintain signal integrity and ensure reliable data transmission.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX027H3F35E2LG to prevent overheating and maintain optimal operating conditions. Incorporate heat sinks, thermal vias, and proper airflow in the system design to dissipate heat effectively.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring synchronous operation and maximum performance of 10AX027H3F35E2LG. Use low-skew clock buffers, phase-locked loops (PLLs), and proper clock routing techniques for stable clock signals.

5. I/O Optimization:

Optimize the configuration of I/O standards, drive strengths, and slew rates to match the requirements of the connected devices and interfaces. Use differential signaling, impedance control, and proper termination to enhance signal quality and reduce noise.

Considerations:

When designing with 10AX027H3F35E2LG, it's essential to consider:

- Design Constraints: Understand the timing, area, and power constraints of the FPGA and optimize the design accordingly to meet performance targets.

- Resource Utilization: Efficiently utilize the available logic resources, memory blocks, and DSP slices of 10AX027H3F35E2LG to minimize resource wastage and maximize design scalability.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to ensure functionality, performance, and compliance with specifications.

- Design Reusability: Design the system with modularity and scalability in mind to facilitate reuse of IP cores, modules, and subsystems in future projects or iterations.

- Design Security: Implement security measures such as bitstream encryption, authentication, and tamper detection to protect the intellectual property and sensitive data stored in the FPGA configuration.

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3. Are the 10AX027H3F35E2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027H3F35E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027H3F35E2LG we delivered, we will accept the replacement or return of the 10AX027H3F35E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027H3F35E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations