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Name: 10AX027H2F35I1SG
Brand: Intel
SKU: 10AX027H2F35I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027H2F35I1SG

Part No.:: 10AX027H2F35I1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX027H2F35I1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3776

Quantity:: Add To Cart

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10AX027H2F35I1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

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10AX027H2F35I1SG information

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10AX027H2F35I1SG Application Introduction

10AX027H2F35I1SG is a field-programmable gate array (FPGA) chip renowned for its high performance and versatility in various digital design projects.

Project Overview:

In digital design projects, 10AX027H2F35I1SG can be effectively utilized for tasks such as signal processing, data encryption, and embedded system control.

Circuit Design:

To optimize the design utilizing 10AX027H2F35I1SG, consider the following:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of 10AX027H2F35I1SG and associated components. Utilize voltage regulators and decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay close attention to signal integrity to prevent issues such as signal distortion and crosstalk. Use proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity throughout the design.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating of 10AX027H2F35I1SG. Utilize heat sinks, thermal vias, and proper airflow design to dissipate heat efficiently and ensure reliable operation under varying thermal conditions.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX027H2F35I1SG and other components. Pay attention to clock skew, jitter, and clock routing to ensure proper functioning of synchronous circuits.

5. I/O Planning:

Optimize I/O planning to ensure compatibility and proper interfacing with external devices and peripherals. Consider factors such as voltage levels, signal standards, and I/O standards to facilitate seamless communication between 10AX027H2F35I1SG and external components.

Considerations:

When designing with 10AX027H2F35I1SG, it's essential to consider:

- Design Constraints: Understand and adhere to design constraints such as timing requirements, resource utilization, and power budget to optimize the design for performance and efficiency.

- Design Validation: Thoroughly validate the design through simulation and testing to ensure functionality, reliability, and compliance with design specifications.

- Design Iteration: Iteratively refine the design based on feedback from simulations and testing to address any identified issues and improve overall design performance.

- Design Documentation: Maintain comprehensive design documentation to facilitate collaboration, troubleshooting, and future revisions of the design.

- FPGA Resources: Efficiently utilize FPGA resources such as logic cells, memory blocks, and DSP slices to maximize the design's capability and minimize resource wastage.

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6. What is the process for return or replacement of 10AX027H2F35I1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027H2F35I1SG we delivered, we will accept the replacement or return of the 10AX027H2F35I1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027H2F35I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations