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Name: 10AX027H2F35E1SG
Brand: Intel
SKU: 10AX027H2F35E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027H2F35E1SG

Part No.:: 10AX027H2F35E1SG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX027H2F35E1SG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3488

Quantity:: Add To Cart

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10AX027H2F35E1SG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027H2F35E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027H2F35E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027H2F35E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027H2F35E1SG information

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10AX027H2F35E1SG Application Introduction

10AX027H2F35E1SG is a field-programmable gate array (FPGA) chip known for its high-performance capabilities and flexibility in various electronic design applications.

Application Scenario:

In digital signal processing (DSP) applications, 10AX027H2F35E1SG can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 10AX027H2F35E1SG in your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 10AX027H2F35E1SG. Utilize low-dropout voltage regulators and power gating techniques to control power distribution to different sections of the FPGA.

2. Signal Integrity:

Design the PCB layout to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Use impedance-matched traces, ground planes, and proper decoupling capacitors to maintain signal integrity and reduce noise.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX027H2F35E1SG to prevent overheating and maintain reliable operation. Use thermal vias, heat sinks, or fans to dissipate heat effectively and optimize the FPGA's performance under varying thermal conditions.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to the FPGA and associated components. Minimize clock skew and jitter by carefully routing clock traces and using PLLs (Phase-Locked Loops) for clock generation and synchronization.

5. Design Partitioning:

Partition the design into smaller, manageable blocks to optimize resource utilization and improve design scalability. Use hierarchical design methodologies to facilitate modular design, simulation, and verification processes.

Considerations:

When designing with 10AX027H2F35E1SG, keep the following considerations in mind:

- Resource Utilization: Optimize the use of FPGA resources, such as logic elements, memory blocks, and DSP slices, to meet performance and resource constraints.

- Timing Closure: Perform timing analysis and optimization to ensure that all timing constraints are met, avoiding timing violations and achieving reliable operation at the target clock frequency.

- Design Constraints: Consider design constraints, such as pin assignments, I/O standards, and package options, to ensure compatibility with the target hardware platform and facilitate successful integration into the system.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototype testing to validate functionality, performance, and compliance with specifications before deployment.

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6. What is the process for return or replacement of 10AX027H2F35E1SG?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027H2F35E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations