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Name: 10AX027H2F34E1HG
Brand: Intel
SKU: 10AX027H2F34E1HG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027H2F34E1HG

Part No.:: 10AX027H2F34E1HG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 10AX027H2F34E1HG.pdf

Description:: IC FPGA 384 I/O 1152FBGA

In Stock:: 3819

Quantity:: Add To Cart

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10AX027H2F34E1HG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
384
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027H2F34E1HG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027H2F34E1HG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027H2F34E1HG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027H2F34E1HG information

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10AX027H2F34E1HG Application Introduction

10AX027H2F34E1HG is a field-programmable gate array (FPGA) chip known for its high performance and versatility, commonly used in various electronic design projects for applications ranging from telecommunications to industrial automation.

Application Scenario:

In a telecommunications project, 10AX027H2F34E1HG can be utilized for tasks such as signal processing, protocol handling, and encryption/decryption in communication networks.

Circuit Design:

To effectively incorporate 10AX027H2F34E1HG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power consumption of 10AX027H2F34E1HG and associated components. Utilize low-dropout voltage regulators and power-saving modes to minimize energy wastage.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal distortions. Proper ground and power plane placement, controlled impedance traces, and signal termination techniques are crucial for reliable communication within the FPGA and with external components.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating of 10AX027H2F34E1HG during operation. Use heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat generated by the FPGA and ensure long-term reliability.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and synchronized clock signals throughout the FPGA design. Use low-skew clock distribution techniques, such as fanout buffers and clock tree synthesis, to minimize clock skew and timing uncertainties.

5. I/O Planning:

Carefully plan the input/output (I/O) configuration of 10AX027H2F34E1HG to optimize signal routing and minimize signal interference. Group related I/O signals together, use differential signaling for high-speed interfaces, and employ impedance matching techniques to enhance signal integrity and reliability.

Considerations:

When designing with 10AX027H2F34E1HG, keep in mind the following key considerations:

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize resource constraints.

- Design Validation: Thoroughly validate the FPGA design through simulation, emulation, and prototyping to ensure functional correctness and performance requirements are met.

- Design Security: Implement security features such as bitstream encryption and authentication to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Compliance and Standards: Ensure compliance with industry standards and regulatory requirements relevant to your application, such as FCC for electromagnetic interference (EMI) and safety standards for industrial equipment.

- Future Scalability: Design the FPGA system with scalability in mind to accommodate future upgrades and enhancements, ensuring long-term viability and flexibility for evolving project requirements.

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3. Are the 10AX027H2F34E1HG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027H2F34E1HG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027H2F34E1HG we delivered, we will accept the replacement or return of the 10AX027H2F34E1HG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027H2F34E1HG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations