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Name: 10AX027E4F29I3SG
Brand: Intel
SKU: 10AX027E4F29I3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E4F29I3SG

Part No.:: 10AX027E4F29I3SG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX027E4F29I3SG.pdf

Description:: IC FPGA 360 I/O 780FBGA

In Stock:: 2380

Quantity:: Add To Cart

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10AX027E4F29I3SG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX027E4F29I3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E4F29I3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E4F29I3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E4F29I3SG information

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10AX027E4F29I3SG Application Introduction

10AX027E4F29I3SG is a field-programmable gate array (FPGA) chip known for its high-performance computing capabilities and versatile functionality, widely used in various electronic design projects.

Application Scenario:

In a digital signal processing application, 10AX027E4F29I3SG can be utilized to implement complex algorithms for real-time data processing, such as audio or image processing in multimedia systems.

Circuit Design:

To effectively utilize 10AX027E4F29I3SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption of 10AX027E4F29I3SG and associated peripherals. Utilize power gating, dynamic voltage scaling, and clock gating strategies to minimize power usage during idle and low-load conditions.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure reliable signal integrity. Follow high-speed design practices, such as impedance matching, controlled impedance traces, and signal isolation, to mitigate signal reflections, crosstalk, and electromagnetic interference.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating of 10AX027E4F29I3SG and ensure reliable operation under various operating conditions. Utilize heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat generated by the FPGA and associated components.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and jitter, ensuring synchronous operation of all internal logic elements. Use global and regional clock networks efficiently, and carefully route clock signals to minimize timing violations and maximize performance.

5. I/O Planning:

Plan and optimize the I/O placement and routing to minimize signal propagation delays and maximize signal integrity. Group related I/Os together, utilize differential signaling for high-speed interfaces, and implement proper termination schemes to minimize reflections and ensure signal integrity.

Considerations:

When designing with 10AX027E4F29I3SG, it's essential to consider:

- Design Validation: Perform thorough functional testing and verification to ensure correct operation and functionality of the FPGA design under various conditions.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Design Scalability: Design the FPGA system with scalability in mind, allowing for future expansion and upgrades to accommodate evolving project requirements.

- Design Documentation: Maintain comprehensive design documentation, including schematics, PCB layouts, and design constraints, to facilitate debugging, troubleshooting, and future design iterations.

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3. Are the 10AX027E4F29I3SG price and inventory displayed accurate?

The price and inventory of 10AX027E4F29I3SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX027E4F29I3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E4F29I3SG we delivered, we will accept the replacement or return of the 10AX027E4F29I3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E4F29I3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations